SUNNYVALE, Calif. — (BUSINESS WIRE) — September 21, 2016 — Rambus Inc. (NASDAQ: RMBS):
|Rambus Inc. (NASDAQ: RMBS)|
|TSMC 2016 Open Innovation Platform Ecosystem Forum|
|San Jose McEnery Convention Center|
|Rambus booth # 412|
|September 22, 2016|
Rambus will participate in the TSMC Open Innovation Platform (OIP) Ecosystem Forum and showcase its high-speed SerDes portfolio, including technologies stemming from the recently-acquired Snowbush IP assets. Rambus’ collaboration with TSMC optimizes the development of its high-speed SerDes in TSMC's process technologies to address the challenges of data-intensive markets, including networking and data centers. For additional information about Rambus’ SerDes IP, please visit https://www.rambus.com/memory-and-interfaces/serdes/.
About Rambus Memory and Interfaces Division (MID)
The Rambus Memory and Interfaces Division develops products and services
that solve the power, performance, and capacity challenges of the
mobile, connected device, and cloud computing markets. Rambus enhanced
standards-compatible and custom memory and serial link solutions include
chips, architectures, memory and chip-to-chip interfaces, DRAM, IP
validation tools, and system and IC design services. Developed through
our system-aware design methodology, Rambus products deliver improved
time-to-market and first-time-right quality.