Rambus to Showcase Its High-Speed SerDes Portfolio at the TSMC 2016 Open Innovation Platform® Ecosystem Forum

SUNNYVALE, Calif. — (BUSINESS WIRE) — September 21, 2016 — Rambus Inc. (NASDAQ: RMBS):

Who:

      Rambus Inc. (NASDAQ: RMBS)
 

Where:

TSMC 2016 Open Innovation Platform Ecosystem Forum
San Jose McEnery Convention Center
Rambus booth # 412
 

When:

September 22, 2016
 

Rambus will participate in the TSMC Open Innovation Platform (OIP) Ecosystem Forum and showcase its high-speed SerDes portfolio, including technologies stemming from the recently-acquired Snowbush IP assets. Rambus’ collaboration with TSMC optimizes the development of its high-speed SerDes in TSMC's process technologies to address the challenges of data-intensive markets, including networking and data centers. For additional information about Rambus’ SerDes IP, please visit https://www.rambus.com/memory-and-interfaces/serdes/.

Follow Rambus

Company website:  rambus.com
Rambus blog:  rambusblog.com
Twitter:  @rambusinc
LinkedIn:  www.linkedin.com/company/rambus
Facebook:  www.facebook.com/RambusInc

About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

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