eSilicon to Present on HBM/2.5D at TSMC Open Innovation Platform Ecosystem Forum 2016

SAN JOSE, CA--(Marketwired - September 15, 2016) - eSilicon, a leading semiconductor design and manufacturing solutions provider, will present Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions at the TSMC Open Innovation Platform (OIP) Ecosystem Forum on September 22, 2016.

What:
The next generation of high-performance computing, graphics and networking applications have increasing needs for bandwidth. High-bandwidth memory (HBM) combined with 2.5D technology offers a tremendous increase in capacity and performance. Increased capacity because of the stacked memory in a smaller area and increased performance because of the interposer and shorter signal routing. The interposer allows the integration of highly parallel connections to the memory stacks inside the package, therefore it is able to offer huge capacity and performance increases.

This presentation will highlight the silicon characteristics of eSilicon's HBM PHY in TSMC's CLN28HPC technology. The presentation will also highlight TSMC CoWoS technology as well as complex ASICs that use high-bandwidth memory.

Who:
Lisa Minwell, senior director, IP marketing, eSilicon Corporation

When:
September 22, 2016

Where:
San Jose McEnery Convention Center
150 West San Carlos Street
San Jose, CA 95113

About TSMC 2016 OIP Ecosystem Forum
The TSMC OIP Ecosystem Forum is a one-of-a-kind event that brings together the semiconductor design chain community and approximately 1,000 of director-level and above TSMC customer executives. The OIP Forum will feature a day-long, three-track technical conference along with an Ecosystem Pavilion that will host up to 80 member companies.

About eSilicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the automotive, communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com

The right chip. Right now™




Contacts: 
Sally Slemons
eSilicon Corporation 
408-635-6409 

Email contact


Susan Cain Cain Communications 408-393-4794 Email contact




Review Article Be the first to review this article
CST Webinar Series

EMA:

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Retail Therapy: Jump starting Black Friday
Peggy AycinenaIP Showcase
by Peggy Aycinena
REUSE 2016: Addressing the Four Freedoms
More Editorial  
Jobs
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
AE-APPS SUPPORT/TMM for EDA Careers at San Jose-SOCAL-AZ, CA
ACCOUNT MANAGER MUNICH GERMANY EU for EDA Careers at MUNICH, Germany
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Upcoming Events
Zuken Innovation World 2017, April 24 - 26, 2017, Hilton Head Marriott Resort & Spa in Hilton Head Island, SC at Hilton Head Marriott Resort & Spa Hilton Head Island NC - Apr 24 - 26, 2017
CST Webinar Series



Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy