Open-Silicon to Participate in Panel Discussion About Multi-Die IC Design and Manufacturing at IEEE EDPS in Monterey

MILPITAS, CA--(Marketwired - April 19, 2016) - Open-Silicon, a system-optimized ASIC solution provider, today announced that Vice President of Manufacturing Operations Asim Salim will be a featured panelist and presenter at the IEEE Electronic Design Process Symposium (EDPS) event in Monterey, CA on April 21.

What: IEEE Electronic Design Process Symposium 2016

Presentation: Multi-Die ASIC SiP (System in Package) Manufacturing

Panel: Multi-Die IC Design and Application

Who: Asim Salim, Vice President of Manufacturing Operations, Open-Silicon

When: Thursday, April 21, 2016

Session 3, 3:45 PM

Where: Monterey Tides Hotel

2600 San Dunes Drive

Monterey, CA 93940

Presentation Abstract: The adoption of 2.5D technology presents a multitude of game-changing advantages for chip designers facing the complexity and cost of smaller geometries. Adding interposer into the design increases the complexity of package design, assembly and testing both at the wafer level and the SiP level. This discussion will focus on challenges and solutions for the 2.5D ASIC SiP manufacturing supply chain ecosystem. The manufacturing supply chain ecosystem for key applications driving 2.5D ASIC SiP will also be discussed.

About EDPS

The Electronic Design Process Symposium has fostered the free exchange of ideas among the top thinkers, movers and shakers who focus on how chips and systems are designed in the electronics industry. It provides a forum for this cross-section of the design community to discuss state-or-the-art improvements to electronics design processes and CAD methodologies, rather than on the functions of the individual tools themselves. To register for the event, please visit the EDPS registration page.

About Open-Silicon

Open-Silicon transforms idea into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design -- architecture, logic, physical, system, software, and IP -- and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing, and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped over 110 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.



Purvi Shenoy
Open-Silicon
408-240-5772

Email contact


Media Contact: Jennifer DeAnda 208-794-7113 Email contact




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