UMC Holds 2016 China Technology Forum

Foundry to highlight its “Innovation by Collaboration” model and competitive process technologies

Hsinchu, Taiwan, April 15, 2016 -- United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today held its 2016 China Technology Forum at the Evergreen Laurel Hotel in Shanghai, China.

UMC’s forum theme this year is focused on the foundry’s “Innovation by Collaboration” business model that leverages strategic partnerships to realize accelerated, mutual success in areas such as R&D, IP, market development and bringing customer products to timely volume production. The event also serves as a platform for UMC and its ecosystem partners to showcase their strengths in process technology, manufacturing, EDA, IP, testing, packaging and market applications to support China’s fast growing high-tech industry. UMC’s CEO, Po Wen Yen, delivered the keynote speech. Other distinguished guest speakers included Dr. Wei Shaojun, vice chairman of China Semiconductor Industry Association and Li Ke, vice president of CCID Consulting Co.  

CEO Yen said, “While Moore’s law still serves performance intensive applications such as data servers and advanced smart phones, other high-tech segments are experiencing explosive growth including automotive ICs, IOT, AR/VR, UAV, medical and robot/ These diverse vertical markets requires strong partnerships and comprehensive technologies in order to realize customized application specific solutions.”

Mr. Yen continued, “UMC has a successful track record of delivering rapid results through close collaboration with customers and supply chain partners. We work closely with customers to create customized technology solutions to help differentiate their products in the marketplace, while also offering specialized IP and application platform programs that help chip designers lower their engagement barrier with UMC. We look forward to bringing these benefits to China customers to help increase their competitive advantage.”

UMC’s China manufacturing bases consists of HeJian, a high-volume 8” inch fab in Suzhou, and United Semiconductor, an advanced 12” joint venture fab located in Xiamen that is scheduled for production in late 2016. The company also operates United Design Service in Shandong, which offers turnkey design service to China customers. In addition to highlighting UMC’s partnership model at the technology forum, the foundry will also showcase its competitive technology offerings such as 14nm FinFET, volume production 28nm high-k/metal gate, RFSOI, MEMS, 2.5D/3DIC, BCD and automotive IC grade 1 and grade 0 manufacturing capabilities.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q11 Grade-0 automotive industry manufacturing capabilities. UMC’s 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S.  Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions.  Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.


Review Article Be the first to review this article


Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Acquiring Mentor: Four Good Ideas, One Great
More Editorial  
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Upcoming Events
SEMICON Europe at Grenoble France - Oct 25 - 27, 2016
ARM TechCon 2016 at Santa Clara Convention Center Santa Clara CA - Oct 25 - 27, 2016
Call For Proposals Now Open! at Santa Clara Convention Center, Santa Clara, CA California CA - Oct 25 - 27, 2016
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
S2C: FPGA Base prototyping- Download white paper

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy