Mentor Graphics Adds Support for Integrated Fan-Out (InFO) Packaging Technology at TSMC

Integration of Calibre and Xpedition Platforms Provides Co-Verification Solution for InFO Design Applications

WILSONVILLE, Ore., March 14, 2016 — (PRNewswire) —  Mentor Graphics Corporation (NASDAQ: MENT) today announced a design, layout, and verification solution to support design applications for TSMC's Integrated Fan-Out (InFO) wafer-level packaging technology. The solution comprises the Calibre® nmDRC physical verification product, the Calibre RVE™ results viewing platform, and the Xpedition® Package Integrator flow. It enables mutual customers to deploy the unique fan-out layer structures and interconnects in the TSMC InFO technology, targeting cost-sensitive applications such as mobile and consumer products.

Mentor Graphics logo.

The interplay between today's advanced system-on-chip (SoC) technologies and packaging requirements is driving the need for co-validation between integrated circuit (IC) and package design environments. The Xpedition Package Integrator flow will be Mentor's platform to support TSMC's unique TSMC InFO design requirements, including integration with other Mentor solutions—the first being Calibre nmDRC and Calibre RVE.

The Mentor® solution allows IC and package designers to view and cross-probe results from the Calibre nmDRC tool directly inside the Xpedition Package Integrator flow for verification of TSMC InFO interconnect structures. Because this flow is based on proven integration via the Calibre RVE tool, it results in automated sign-off verification and easier correction of any issues highlighted by the Calibre nmDRC product. It also streamlines the addition of future features and capabilities.

IC designers have widely adopted the Calibre nmDRC tool as their sign-off solution for multiple process node generations. Through the integration with Xpedition Package Integrator, they now share a common view with package developers when performing co-verification.

"We are focused on making our solutions easier for customers to adopt by providing a design methodology that leverages proven EDA design tools," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "Mentor and TSMC have established this InFO methodology through an integration of the Calibre and Xpedition platforms, and will continue to collaborate on enhancing that solution."

"Integrating Calibre nmDRC technology with the Xpedition Package Integrator flow is a solid first step in Mentor's support of TSMC's InFO technology," stated Joe Sawicki, vice president and general manager of Mentor Graphics Design to Silicon Division. "We continue to work with TSMC and its ecosystem to expand beyond this initial step by establishing a roadmap for additional capabilities to further accelerate time-to-market for users of TSMC's InFO offering."

About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of approximately $1.18 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.

For more information, please contact:

David Smith

Mentor Graphics

503.685.1135

david_smith@mentor.com


(Mentor Graphics, Calibre and Xpedition are registered trademarks, and RVE is a trademark, of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)

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To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/mentor-graphics-adds-support-for-integrated-fan-out-info-packaging-technology-at-tsmc-300234923.html

SOURCE Mentor Graphics Corporation

Contact:
Mentor Graphics Corporation
Web: http://www.mentor.com




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