Alliance Memory to Showcase Legacy SDRAMs at electronica China 2016

SAN CARLOS, CA -- (Marketwired) -- Feb 29, 2016 -- Alliance Memory today announced its technology lineup for electronica China, taking place March 15-17 at the Shanghai New International Expo Centre. In booth E2.2127, the company will highlight its latest synchronous DRAMs (SDRAM), including high-speed CMOS double data rate (DDR1), low-power mobile DDR1 (MDDR1), DDR2, and DDR3 SDRAMs in a wide range of package options, in addition to components recently discontinued by Micron Semiconductor.

At electronica China, Alliance Memory will highlight SDRAMs with densities from 16 Mb to 512 Mb, available in a variety of TSOP, FBGA, and TFBGA packages and with commercial (0 degrees C to +70 degrees C), industrial (-40 degrees C to +85 degrees C), and automotive (-40 degrees C to +105 degrees C) temperature ranges. Products on display will include the company's legacy Micron Semiconductor 512 Mb SDRAMs in the 54-pin TSOP II package. PC100- and PC133-compliant, the MT48LC32M16A2P-75: C, MT48LC32M16A2P-75 IT:C, MT48LC64M8A2P-75:C, and MT48LC64M8A2P-75 IT:C operate from a single +3.3 V (+/-0.3 V) power supply.

Alliance Memory will showcase DDR1 SDRAMs with densities of 64 Mb, 128 Mb, 512 Mb, and 1 Gb in the 66-pin TSOP II package with a 0.65-mm pitch, in addition to 60-ball TFBGA and 144-ball FBGA options. The devices feature fast clock rates of 200 MHz and 166 MHz and operate from a single +2.5-V (+/-0.2 V) power supply. Highlighted DDR2 SDRAMs will offer densities from 256 Mb to 2 Gb in 60-ball 8-mm by 10-mm by 1.2-mm and 84-ball 8-mm by 12.5-mm by 1.2-mm FBGA packages. The devices operate from a single +1.8-V (+/-0.1 V) power supply, and they will include Alliance Memory's new 2-Gb AS4C128M16D2 in the 84-ball FBGA, which is available from a very limited number of suppliers.

For newer-generation microprocessors, Alliance Memory will highlight DDR3 and low-voltage DDR3L SDRAMs with densities of 1 Gb, 2 Gb, 4 Gb, and 8 Gb in 78-ball 9-mm by 10.5-mm by 1.2-mm and 96-ball 9-mm by 13-mm by 1.2-mm FBGA packages. The devices offer extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz. The DDR3 SDRAMs operate from a single +1.5-V (+/-0.075 V) power supply, while the DDR3L SDRAMs operate from a single +1.35-V power supply.

Also on display will be low-power MDDR1 SDRAMs in densities from 256 Mb to 2 G that operate from a single +1.8-V power supply, feature clock frequencies of 166 MHz and 200 MHz, and offer data rates of 333 Mbps/pin and 400 Mbps/pin. The devices are available in 60-ball and 90-ball FPBGA packages and commercial (-25 degrees C to +85 degrees C), extended (-30 degrees C to +85 degrees C), and industrial (-40 degrees C to +85 degrees C) temperature ranges.

Alliance Memory's SDRAMs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, medical, communications, and telecom products requiring high memory bandwidth, and they are particularly well-suited to high performance in PC applications. The devices eliminate costly redesigns by providing long-term support for end-of-life (EOL) components. In addition, the company performs minimal or no die shrinks, which frees up engineering resources.

Founded in 2002, electronica China is one of the leading platforms for electronic components, systems, and applications. More information on the show is available at

About Alliance Memory Inc.
Alliance Memory is a worldwide provider of legacy memory products for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company's product range includes a full range of asynchronous and synchronous SRAMs, low-power SRAMs, ZMD low-power SRAMs, 3.3 V synchronous DRAMs (SDR), mobile DDRs, and 2.5 V single (DDR1), 1.8 V double (DDR2), and 1.5 V and 1.35 V triple rate (DDR3) synchronous DRAMs. Depending on the family, these products are available with commercial, industrial, and automotive operating temperature ranges and with densities from 64K to 8G. Alliance Memory is a privately held company with headquarters in San Carlos, California, and regional offices in the United Kingdom, France, Italy, China, and Southeast Asia. More information about Alliance Memory is available online at

Micron and the Micron orbit logo are trademarks of Micron Technology Inc. All other trademarks are the property of their respective owners.

Agency Contact:
Bob Decker
+1 415 409 0233

Email Contact 

Alliance Memory Contact:
Kim Bagby
+1 650 610 6800

Email Contact 

Review Article Be the first to review this article


Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Acquiring Mentor: Four Good Ideas, One Great
More Editorial  
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Upcoming Events
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
2016 International Conference On Computer Aided Design at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
ICCAD 2016, Nov 7-10, 2016 at Doubletree Hotel in Austin, TX at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
Electric&Hybrid Aerospace Technology Symposium 2016 at Conference Centre East. Koelnmesse (East Entrance) Messeplatz 1 Cologne Germany - Nov 9 - 10, 2016
S2C: FPGA Base prototyping- Download white paper

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy