GRENOBLE, France — 23 February 2016 — SEMI today announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2016 which takes place 25-27 October in Grenoble, France.
SEMICON Europa 2016 will feature more than 100 hours of technical sessions and presentations focused on critical industry topics that are shaping the design and manufacturing of semiconductors, MEMS, printed and flexible electronics, and other related technologies. Abstracts for presentations are now being accepted for:
- Advanced Packaging Conference: “The Balancing Act between Consumer and Harsh Environment Packaging”
- Power Electronics Conference: “The Power Awakens”
- 2016FLEX Europe: “Silicon Electronics + Flexible Systems Enabling New Markets”
The SEMICON Europa 2016 abstract submission deadline is 29 April. Prospective presenters are invited to submit abstracts (1,000-2,000 characters). Material must be original, non-commercial and non-published. Abstracts must clearly detail the nature, scope, content, organization, key points, and significance of the proposed presentation. Visit www.semiconeuropa.org or contact Christina Fritsch, SEMI Europe, at Tel: +49 30 303080770or email Email Contact.
Co-located and leveraging SEMICON Europa 2016, 2016FLEX Europe(formerly known as PE Europe)will also take place in Grenoble from 25-27 October.
SEMICON Europa and 2016FLEX Europe (now powered by SEMI’s Strategic Association Partner FlexTech) will attract over 5,500 attendees involved in the microelectronics supply chain, from equipment and material suppliers, IC manufacturers, system integrators to end users. Special programs this year focus on advanced and smart manufacturing (Industry 4.0), power electronics, imaging, electronics and materials for the medical and automotive applications, creating an opportunity to explore applications and manufacturing solutions for flexible, printed and hybrid electronics.
About SEMICON Europa
SEMICON Europa is the annual premier event for the global electronics industry in Europe, rotating yearly between Dresden and Grenoble. The event covers new products and technologies for electronics design and manufacturing, and features technologies from across the electronics supply chain, from electronic design automation to device fabrication (wafer processing) to final manufacturing (assembly, packaging, and test). SEMICON Europa also features emerging markets and technologies, including MEMS and flexible electronics, and a wide range of products, including power electronics, sensors, organic and flexible electronics, imaging devices, bioelectronics, automotive, and other exciting new technologies. For more information on SEMICON Europa, please visit: www.semiconeuropa.org.
SEMI® connects more than 1,900 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.