Leading-edge process technology supports data storage and computational demands of increasingly complex automotive infotainment applications
TOKYO — (BUSINESS WIRE) — January 5, 2016 — Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced the launch of 15nm e･MMC TM  NAND flash memories for automotive applications. Toshiba’s automotive e･MMC features a wide operating temperature range of -40oC to 85oC, the smallest class chip size available for automotive , an 11.5x13mm JEDEC standard package, and high reliability. Sample shipments start from today.
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Toshiba: e-MMC(TM) NAND Flash Memory for Automotive Applications (Photo: Business Wire)
Toshiba's new line-up of single-package embedded NAND flash memories is suited to the demanding requirements of the automotive infotainment market, and includes densities from 8 gigabyte (GB) to 64GB. Each device integrates a controller to manage basic control functions for NAND applications.
According to industry analyst firm Gartner, the majority of vehicles will be connected to the Internet in just five years, with 60 percent to 75 percent of them being capable of consuming, creating and sharing Web-based data. From maps and weather conditions to voice recognition, entertainment, driver assist features and more - cars are quickly becoming much more than just modes of transportation. Accelerated processing power and increased data storage capacity are crucial to enabling all of this connectivity, and Toshiba’s e･MMC NAND flash memory has emerged as the data storage technology of choice for automotive applications.
Toshiba’s 15nm chips used for e･MMC are among the world's smallest. Fully compliant with the latest JEDEC e･MMC standard, the chips are designed for application in a wide range of digital products, including automotive infotainment and industrial applications. Toshiba’s 15nm e･MMC offers fast read/write performance due to improvements in basic chip performance and controller optimization.
Key features include:
• Extended temperature range: -40oC to 85oC
• Low failure rate to support higher quality demands for automotive applications
• Meets AEC-Q100 specifications
• Adheres to PPAP requirements
• Extended support
Outline of the New Products
|Part Number||Density||Operating Temperature Range||Package Size||Mass Production|
|THGBMHG6C1LBAAL||8GB||-40oC to 85oC||11.5x13x0.8mm||2Q(Apr.-Jun.) 2016|
|THGBMHG7C2LBAAR||16GB||-40 o C to 85 o C||11.5x13x1.0mm||2Q(Apr.-Jun.) 2016|
|THGBMHG8C4LBAAR||32GB||-40 o C to 85 o C||11.5x13x1.0mm||2Q(Apr.-Jun.) 2016|
|THGBMHG9C8LBAAG||64GB||-40 o C to 85 o C||11.5x13x1.2mm||2Q(Apr.-Jun.) 2016|
e ･MMC is a product category for a class of embedded memory products built to the JEDEC e ･MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association.
|||As of January 6, 2016. Toshiba survey.|
|||Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications.|
|||From Gartner report: “Predicts 2015: Internet of Things”|
|*Maximum read and write speed may vary depending on the host device, read and write conditions, and file size.|
|*For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes.|