DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) for 802.11ac Access Points Using TSMC Standard CMOS Process

LOS ALTOS, Calif., Jan. 05, 2016 (GLOBE NEWSWIRE) -- DSP Group®, Inc. (NASDAQ:DSPG), announced the launch of SparkPA – a revolutionary RF Power Amplifier (PA) for the high performance and technically challenging 802.11ac Access Point market, using a standard CMOS Process from TSMC (TWSE: 2330, NYSE: TSM). 

Leveraging a decade of DSP Group’s core expertise in RF and CMOS PA technology, SparkPA achieves more than 100mW of output power at -35db EVM and more than 50 mW at -40db EVM with excellent stability over temperature. When incorporated into access points, SparkPA has been proven to dramatically improve device performance.

SparkPA is now available on DSP Group’s DFE552 Platform. This offering challenges the traditional approach to PA manufacturing, with outstanding RF performance from a standard CMOS process, so opening a window to a $6-10 billion market. SparkPA is well positioned to support the new Wave 2 and Wave 3 802.11ac Access Point requirements, including 160 MHz channel, MU-MIMO at 4x4 and 8x8 topologies as well as future 1024 QAM, leveraging its superior linearity performance. Moreover, the CMOS PA allows frequency and linearity configurability per packet.

"Our work with TSMC has produced the most advanced and high performance CMOS solution for 802.11ac segment," said Ofer Elyakim, CEO of DSP Group. "The 802.11ac power amplifier requirements are considered to be among the most challenging in the RF frontend segment. Our innovative approach allows us to demonstrate groundbreaking EVM noise performance that can deliver the most advanced features required by customers in a cost effective manner. We will continue to innovate and leverage our core expertise in new domains,” he concluded.

“Our more than a decade-long technology collaboration with DSP Group continues to produce innovative results,” said Maria Marced, President, TSMC Europe. “The arrival of the SparkPA is in tune with market demand for cost-effective CMOS PA applications. With the outstanding performance of SparkPA, DSP Group has achieved new levels of product integration and innovation, providing designers with a PA that achieves the performance, power and area goals for their RF designs. TSMC looks forward to continuing our collaboration with DSP Group," she continued.

About DSP Group
DSP Group®, Inc. (NASDAQ:DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office, and on the go. For more information, visit www.dspg.com.

Contact
Tali Chen, CVP Corporate Development,+1(408) 240-6826,
tali.chen@dspg.com

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