DASIP 2016 - Call for Papers
| | Rate | Review | Notices

Conference on Design and Architectures
for Signal and Image Processing

October 12-14, 2016
Rennes, France

General Co-Chairs:
Emmanuel Casseau,

University of Rennes 1, IRISA, FR

William P. Marnane,

Univ. College Cork, SFI INFANT, IE

Program Co-Chairs:

Jean-François Nezan,


Yannick Le Moullec

Tallinn University of Technology, EST


Abstract submission final deadline: April 22 - Paper submission final deadline: April 29

Technical Co-Sponsorship:




The Conference on Design and Architectures for Signal and Image Processing – DASIP provides an inspiring international forum for the latest innovations and developments in the field of leading edge embedded signal processing systems. Theconference program will include keynote speeches, contributed paper sessions, demonstrations, and special sessions on timely topics. Authors are invited to submit manuscripts on topics including, but not limited to:

Design Methods and Tools

  • Design verification and fault tolerance
  • Embedded system security and security validation
  • System-level design and hardware/software co-design
  • Communication synthesis, architectural and logic synthesis
  • Embedded real-time systems and real-time operating systems
  • Rapid system prototyping, performance analysis and estimation
  • Formal models, transformations, algorithm transformations and metrics


Development Platforms, Architectures and Technologies

  • Embedded platforms for multimedia and telecom
  • Many-core and multi-processor systems, SoCs, and NoCs
  • Reconfigurable ASIPs, FPGAs, and dynamically reconfigurable systems
  • Asynchronous (self-timed) circuits and analog and mixed-signal circuits
  • Digital bio-signal processing, biologically based and/or inspired systems


Use-Cases and Applications

  • Ambient intelligence, ubiquitous and wearable computing
  • Global navigation satellite systems, smart cameras, and PDAs
  • Security systems, cryptography, object recognition and tracking
  • Embedded systems for automotive, aerospace, and health applications


Smart Sensing Systems

  • Sensor networks, environmental and system monitoring
  • Vision, audio, fingerprint, health monitoring, and biosensors
  • Structurally-embedded, distributed, and multiplexed sensors
  • Sensing for active control systems, adaptive and evolutionary sensors




DASIP 2016 will feature three Special Sessions with the purpose of introducing the DASIP community to relevant hot topics that were not covered by previous editions of the conference.

Proposals should be sent via e-mail to Program Chairs Jean-Francois.Nezan@insa-rennes.fr and yannick@elin.ttu.ee




During the DASIP 2016 Demo Night, universities and public research institutes are invited to demonstrate their hardware platforms, prototypes and tools. Authors should submit their full papers (up to 2 pages, double-column IEEE format) in PDF through the web based submission system. Accepted Demo Night papers will be published in the ECSI proceedings and those containing new scientific results have the option to be submitted for inclusion in the IEEE Digital Xplore Library (To be confirmed). The demo night 2016 will be chaired by Kevin J. M. Martin ( Univ. of South Brittany, Lab-STICC, FR ) and Eduardo Juárez, ( Univ. Politécnica de Madrid, ES).



Special Session Proposal :

February 26, 2016

Special Session notification of acceptance

March 25, 2016

Abstract submission deadline:

April 22, 2016

Paper submission deadline:

April 29, 2016

Demo Night paper submission:

May 13, 2016

Notification of acceptance:

June 24, 2016

Camera ready papers:

September 2, 2016



Authors should submit their full papers (up to 8 pages, double-column IEEE format) in PDF through the web based submission system (Demo Night - 2 pages) . Proceedings of DASIP 2016 will be submitted for inclusion into IEEE Xplore. Submitted papers are required to describe original unpublished work and must not be under consideration for publication elsewhere. Submissions must be fully anonymous, but authors should not hide previous work, instead, they need to make self-references in third person.

Full submission requirements, templates and submission instructions can be found at: http://www.ecsi.org/dasip/submissions


Each submission will receive at least three independent double blind reviews from the members of our scientific committee. Authors of accepted papers must address those comments in the camera ready version and present it in the conference prior to its publication. The conference proceedings will be published in electronic form with an ISSN and ISBN number and made available on the ECSI website and submitted for inclusion in the IEEE Xplore Digital Library. Paper and keynote presentation slides and tutorial documents will be made available to ECSI members and conference attendees after the conference (subject to confidentiality issues). Authors of the best papers will be invited to submit an extended version of their work to the Elsevier Journal of System Architecture (JSA).




DASIP 2016 is organized by the European Electronic Chips and Systems design Initiative (ECSI) together with the University of Rennes 1, the French National Institute for computer science and applied mathematics (INRIA), the Institute for Research in IT and Random Systems (IRISA) and the Institute of Electronics and Telecommunications of Rennes (IETR)





Review Article Be the first to review this article
DownStream: Solutions for Post Processing PCB Designs
TrueCircuits: IoTPLL

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise