Advanced Semiconductor Packaging Drives Materials Consumption through 2019

“Thinner and Smaller” Continues to Dominate Packaging Industry

SAN JOSE, Calif. — December 14, 2015 — According to the newly released “Global Semiconductor Packaging Materials Outlook — 2015/2016 Edition,” the $18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire. Segments such as wafer-level packaging (WLP) dielectrics will experience stronger unit volume growth over the same timeframe. The new report by  SEMI and TechSearch International covers laminate substrates, leadframes, bonding wire, mold compounds, underfill materials, liquid encapsulants, die attach materials, solder balls, wafer level package dielectrics, and thermal interface materials. 

Packaging materials are a key enabler to increasing the functionality of thinner, smaller packages consumed in smart phones and other mobile products. Many options are currently available to meet form factor requirements for mobile products such as stacked-die chip scale package (CSP), land grid array (LGA) and fine pitch ball grid array (FBGA) packages, package-on-package (PoP), wafer-level package (WLP), Quad Flat No-lead (QFN) and other packages, using both wirebond and flip chip interconnects.

Key observations include:

  • FO-WLP is emerging as a disruptive technology, changing the demand for the types of packaging materials used in the industry
  • Need for WLP dielectric materials for multi-layer redistribution layers
  • New materials for laminate substrates and underfill to pitch decreasing pitch and bump height trends in flip chip packaging
  • Improved mold compounds for warpage control and package reliability
  • For QFN packaging, cost optimization through enhanced designs and reduced plating area; higher lead counts (routable); improved power dissipation
  • Continued growth in copper and silver wire
  • Materials and processes compatible with tighter tolerances for higher density leadframes and substrate packaging, and for compact multi-die system-in-package (SiP) configurations

Constrained industry growth and the trend towards lower-cost electronics have reshaped the packaging material supplier landscape. Changes in material sets, the emergence of new package types, and cost reduction pressures have resulted in recent consolidation in various material segments. In addition, materials consumption in some segments is declining given the changes in package form factors and the trend towards smaller, thinner packaging (see Figure).

Mold Compound -- annual consumption

Source: SEMI and TechSearch International, Global Semiconductor Packaging Materials Outlook 2015/2016 Edition

The findings in the report are based on over 150 in-depth interviews conducted with semiconductor manufacturers, fabless semiconductor companies, packaging subcontractors, and packaging materials suppliers throughout the world. The report covers details about the industry growth and trends for the various material segments. Information includes market size, regional data, unit trends, and market share. It includes previously unpublished data on revenue, unit shipments and market shares for each packaging material segment; a five-year forecast of revenue and units from 2015 to 2019; supplier rankings (for key segments) and listing (including new players); and an analysis of regional market trends and size. All of the information was derived from the  SEMI Global Packaging Materials Outlook from 2015 to 2019 produced by SEMI and TechSearch International. The report license is available for single user and multi users. SEMI members save 16 percent or more depending on types of license.

For more information about the report( Semiconductor Packaging Materials Outlook—2015-2016 Edition)  and to order your copy,please  click here.

About SEMI

SEMI is the global industry association serving the electronics manufacturing supply chains.  Our more than 2,000 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives.   Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges.  SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.  For more information, visit  www.semi.org.


Contacts 

Dan Tracy/SEMI
Phone: 1.408.943.7987
Email:  Email Contact

Deborah Geiger/SEMI
Phone: 1.408.943.7988
Email:  Email Contact




Review Article Be the first to review this article
CST: Webinar Feb 16, 2017

True Circuits:

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Synopsys: Is 40 the new 20?
More Editorial  
Jobs
Technical Marketing Manager Valley for EDA Careers at San Jose, CA
SoC Design Engineer for Intel at Santa Clara, CA
Technical Support Engineer for EDA Careers at Freemont, CA
Senior Physical Design Engineer for Ambiq Micro at Austin, TX
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
Upcoming Events
3D Printing Electronics Conference at High Tech Campus 1, 5656 Eindhoven Eindhoven Netherlands - Jan 24, 2017
DesignCon 2017 at Santa Clara Convention Center Santa Clara CA - Jan 31 - 2, 2017
Embedded Neural Network Summit at San Jose CA - Feb 1, 2017
International Solid-State Circuits Conference (ISSCC) at San Francisco CA - Feb 5 - 9, 2017
DownStream: Solutions for Post Processing PCB Designs
Verific: SystemVerilog & VHDL Parsers
TrueCircuits: IoTPLL



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy