SEMI European 3D Summit: Beyond TSV in Advanced ICs

GRENOBLE, France - Dec 8, 2015 - SEMI today announced details about the fourth annual European 3D Summit.  Â“ SEMI European 3D Summit 2016: Above and Beyond TSV,” the advanced semiconductor summit will take place on January 18-20 at Minatec in Grenoble, France. With 3D now being much more than just TSV and subsequent stacking technologies, the summit has evolved to encompass 3D as part of the whole advanced packaging continuum.

The SEMI European 3D Summit will include a wide scope of 3D integrated circuit topics beyond Through-Silicon-Via (TSV) technology - with presentations on FO-WLP/ e-WLB, Embedded Die, 3D alternative technologies, new “Start-Up Pitch” session, and companion exhibition with the latest 30 products and services:

  • On 18 January, the Market Briefing session will highlight the latest business challenges and opportunities. Featured 3D and packaging industry experts will include McKinsey, System Plus Consulting, TechSearch International, and Yole Developpement.
  • On 19 January, the 3D Packaging for High-Performance session includes CEA-LETI, ATOS and a keynote from CiscoÂ’s Li Li on “Emerging 2.5D and 3D IC Packaging Platforms for System Integration.”  In the 3D Integration Strategy for Imaging products session, experts from Invensas, Olympus, Redbelt Conseils, and STMicroelectronics will present. The New Technologies session features experts from ASE, Fraunhofer IIS/EAS, imec, and XFab. The final two sessions cover Key Enabling Technologies and Start-Up Pitches.
  • On 20 January, the focus is on “FO-WLP: 3D Options” with a keynote from Ramakanth Alapati of GLOBALFOUNDRIES, plus presentations from AMKOR, Nanium, and SPTS. The final session is on the Manufacturing of 3D Integrated Products with speakers from ams, AT&S, Mentor Graphics, and Xintec.

SEMI will provide attendees networking opportunities throughout the event.  This year, SEMI offers attendees a chance to visit the Minatec Showroom, to learn about the latest innovations being developed in the Grenoble tech hub.

The SEMI European 3D Summit consistently produces a large industry turnout receiving top satisfaction rates (97 percent overall satisfaction rate, 2012-2015).  The  European 3D Summit steering committee includes executives from: ams AG, BESI, CEA-Leti, Evatech, EV Group, Fraunhofer-IZM, imec,  Scint-X,  SPTS, STMicroelectronics and SUSS Microtec.

Please visit  www.semi.org/European3DSummit to register as an attendee or book a booth as an exhibitor. Sponsorship packages are also available. For all additional information, contact Anne-Marie Dutron, SEMI Europe Grenoble Office ( Email Contact).

About SEMI

SEMI is the global industry association serving the electronics manufacturing supply chains.  Our more than 2,000 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives.   Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges.  SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.  For more information, visit  www.semi.org.

Association Contact

Steven Zapata/SEMI Europe
Phone: +49.30.303080770
Email: Email Contact




Review Article Be the first to review this article

ALDEC:

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Reverie: All That Glitters is not Past
More Editorial  
Jobs
Technical Marketing Manager Valley for EDA Careers at San Jose, CA
SoC Design Engineer for Intel at Santa Clara, CA
Technical Support Engineer for EDA Careers at Freemont, CA
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
Senior Physical Design Engineer for Ambiq Micro at Austin, TX
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
Upcoming Events
European 3D Summit 2017 at 3, parvis Louis Néel 38054 Grenoble France - Jan 23 - 25, 2017
3D Printing Electronics Conference at High Tech Campus 1, 5656 Eindhoven Eindhoven Netherlands - Jan 24, 2017
DesignCon 2017 at Santa Clara Convention Center Santa Clara CA - Jan 31 - 2, 2017
Embedded Neural Network Summit at San Jose CA - Feb 1, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy