Microsemi Adds New Device to the Industry's First Family of Inductive Sensor Interface ICs Based upon LVDT Architecture Implementations on PCBs

As a Market Leader in Inductive Sensing Technology, Company Launches LX3302 for Demanding Automotive, Industrial and Commercial Aviation Applications

ALISO VIEJO, Calif., Dec. 1, 2015 — (PRNewswire) —  Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new device in its recently launched family of sensor interface integrated circuits (ICs) based upon inductive sensing technology, the LX3302. As the newest addition to the industry's first inductive sensor interface IC product family utilizing linear variable differential transformer (LVDT) architecture implementations on printed circuit boards (PCB), Microsemi's LX3302 is specially designed for applications within the automotive, industrial and commercial aviation markets.

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Microsemi's LX3302 improves the LX3301A with an extended temperature range to 150 degrees Celsius, and a richer set of system interfaces which include analog sine/cosine outputs, single edge nibble transmission (SENT) and Peripheral Sensor Interfaces (PSI5), as well as the standard analog output and pulse width modulated (PWM) output. In addition, the LX3302 has double the EEPROM available in the LX3301A, allowing for eight-point calibration, versus six-point calibration, which increases system accuracy by 1-bit and permits less precise, lower cost sensor manufacturing. Leveraging Microsemi's expertise in inductive sensing technology and its more than five years' experience supplying customized ICs in production, the new device features LVDT principles, resulting in superior immunity to noise and interference.

"Microsemi is excited to expand our market opportunities with the LX3302, as our inductive sensing technology can replace the incumbent Hall-effect sensors, which are susceptible to external magnetic fields and/or metal objects in close proximity. Inductive technology eliminates the magnet, thereby improving immunity to such interference," said Shafy Eltoukhy, vice president and business unit manager at Microsemi. "Customers can use this emerging technology in a wide variety of mechanical motion sensing applications, as it provides significant improvement in temperature stability, reliability, safety and system costs."

As sensors are the key element in the feedback loop of virtually all closed loop systems, the LX3302 is ideal for a variety of applications related to control systems and industrial automation, including linear displacement measurement (fluid level sensing, gear position for transmission actuator position and brake lamp switch/proximity detection) and angular motion measurement (robotic arm position, rotating shaft position, pedal position and rotary controls). It also meets strict automotive application requirements, including AECQ100-certified grade 0, and comes with Production Part Approval Process (PPAP) documentation support. Microsemi's experienced automotive support team is also provided to ensure customer success with the product.

Additional features include:

  • Contactless sensing, ensuring high reliability
  • Internal temperature sensor
  • -40 to 150 degrees Celsius operating temperature/qualified to AEC-Q100 grade 0
  • Embedded pre-programmed, configurable microcontroller
  • Integrated oscillator and demodulator
  • Two independent sensor input channels with 13-bit analog-to-digital converters (ADCs)
  • Programmable sample rates to 2 kilohertz (kHz)
  • Input electromagnetic interference (EMI) filters
  • 32 x 16 words of user programmable configuration EEPROM
  • Built-in diagnostics and ISO26262 compliance
  • Outputs: 0 to 5 volts (V) analog, PWM, analog sine/cosine, serial interfaces (SENT and PSI5)
  • Eight calibration segments (for shaping and output response)

The implementation of sensors continues to expand throughout the automotive and industrial markets. For example, according to MEMS Journal, the number of new light vehicles (cars and light trucks) shipped worldwide will grow from approximately 85 million in 2014 to 110 million by 2020. These vehicles currently feature an average of 60-100 sensors on board, but as cars are rapidly getting "smarter," the number of sensors is projected to reach as many as 200 sensors per car. This translates to approximately 22 billion sensors used in the automotive industry per year by 2020.    

The LX3302 and other products in the LX33xx sensor IC family can be used with Microsemi's motor drive reference design utilizing the company's SmartFusion2 system-on chip (SoC) field programmable gate array (FPGA) and a motor control IP suite to process the sensor inputs and motor drive algorithms. The sensor inputs can be connected to the motor control evaluation board. For information, visit http://www.microsemi.com/applications/motor-control.

Availability

Pre-production samples of Microsemi's LX3302 are available now, with full production release in March 2016. For more information, visit http://www.microsemi.com/existing-parts/parts/136911 or email Email Contact. For more information about Microsemi's inductive sensor interface ICs based upon LVDT architecture implementations on PCBs, visit http://www.microsemi.com/product-directory/ics/3388-sensor-interface.

About Microsemi's Automotive and Industrial Portfolio

Complementing its leadership in smart sensor interface technology, Microsemi is increasing its value as a systems solution provider with its new automotive-grade qualified SmartFusion2 and IGLOO2 devices—offering advanced security and high reliability features critical for automotive applications. Microsemi's automotive and industrial portfolio also includes power discretes and modules, security software, Ethernet switches and PHYs, audio processors, Power-over-Ethernet (PoE), IEEE 1588 PLLs and software, clock management, component clocks, Wi-Fi RF ICs, and circuit protection devices. For more information about Microsemi's product portfolio for automotive and industrial applications, visit  http://www.microsemi.com/applications/automotive and http://www.microsemi.com/applications/industrial.

About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the first device in its new family of standard product sensor interface ICs based upon inductive sensing technology, the LX3302, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

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