SAN JOSE, Calif — eSilicon Corporation, Northwest Logic and SK Hynix today announced they have created a fully working HBM hardware demonstration. This demonstration uses an advanced FPGA containing Northwest Logic’s HBM Controller Core and FPGA-based HBM PHY and SK Hynix HBM devices. eSilicon packaged the FPGA and HBM devices on an organic interposer. This demonstration is further indication that HBM is ready to be used by the market to implement a wide variety of high-performance, bandwidth-intensive designs. It also demonstrates the ability of eSilicon, Northwest Logic and SK Hynix to support HBM-based designs.
HBM is a JEDEC standard that utilizes “2.5D” packaging. The HBM device consists of a stacked memory array. This array is connected to an ASIC via a silicon or organic interposer. First-generation HBM devices provide eight channels of 128-bit data running at one Gbit/s/pin for a total system throughput of 128 Gbytes/s. Second-generation HBM devices double the throughput. This is approximately 14 times the throughput available from a DDR4 DIMM running at 2,600 Mbits/pin. HBM has both power and cost advantages over competing technologies.
eSilicon Corporation is a leading independent semiconductor design and manufacturing solutions provider, including full service ASIC support for front- and back-end design, custom IP, packaging, test and volume manufacturing. This particular demonstration used a fine-pitch organic interposer. eSilicon also supports packaging of HBM devices with a silicon interposer. “HBM and system-in-package technology hold great promise to break the power and performance bottlenecks designers are currently facing with regard to memory subsystems,” said Bill Isaacson, senior director, product marketing at eSilicon. “This joint effort with Northwest Logic and SK Hynix validates that HBM is ready to enter mainstream use.”
Northwest Logic’s HBM Controller Core supports both Gen 2 (2 Gbit/s/pin) and Gen 1 (1 Gbit/s/pin). The core supports a range of user interfaces and operational modes include Gen 2 pseudo-channel support. As part of this demonstration, Northwest Logic created a complete FPGA design including the HBM Controller Core and FPGA PHY and memory test support. This design provided error-free writes and reads to the HBM device.
“We are excited to collaborate with eSilicon and SK Hynix to show a fully working HBM demonstration,” commented Brian Daellenbach, president of Northwest Logic, Inc. “We are seeing increasing interest in HBM applications. This demonstration shows that eSilicon, Northwest Logic and SK Hynix have the capabilities needed to enable a customer to implement an HBM ASIC.”
“HBM utilizes the latest advancement in DRAM packaging and through-silicon via technologies to enable system designers to extract the maximum value in terms of performance and power efficiency from the DRAM memory subsystem. SK Hynix is in the forefront of bringing the HBM device to the industry and anticipates adoption in multiple major market segments,” said Kevin Tran, senior manager of technical marketing at SK Hynix.
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About Northwest Logic
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (DDR4/3/2, LPDDR4/3/2 SDRAM; HBM, MRAM, RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit www.nwlogic.com.
About SK Hynix Inc.
SK Hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips ("NAND Flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.