Northwest Logic and SK Hynix create high-bandwidth memory (HBM) hardware demonstration

SAN JOSE, Calif. — Sep 10, 2015 — eSilicon Corporation, Northwest Logic and SK Hynix today announced they have created a fully working HBM hardware demonstration. This demonstration uses an advanced FPGA containing Northwest Logic’s HBM Controller Core and FPGA-based HBM PHY and SK Hynix HBM devices. eSilicon packaged the FPGA and HBM devices on an organic interposer. This demonstration is further indication that HBM is ready to be used by the market to implement a wide variety of high-performance, bandwidth-intensive designs. It also demonstrates the ability of eSilicon, Northwest Logic and SK Hynix to support HBM-based designs.

HBM is a JEDEC standard that utilizes “2.5D” packaging. The HBM device consists of a stacked memory array. This array is connected to an ASIC via a silicon or organic interposer. First-generation HBM devices provide eight channels of 128-bit data running at one Gbit/s/pin for a total system throughput of 128 Gbytes/s. Second-generation HBM devices double the throughput. This is approximately 14 times the throughput available from a DDR4 DIMM running at 2,600 Mbits/pin. HBM has both power and cost advantages over competing technologies.

eSilicon Corporation is a leading independent semiconductor design and manufacturing solutions provider, including full service ASIC support for front- and back-end design, custom IP, packaging, test and volume manufacturing. This particular demonstration used a fine-pitch organic interposer. eSilicon also supports packaging of HBM devices with a silicon interposer. “HBM and system-in-package technology hold great promise to break the power and performance bottlenecks designers are currently facing with regard to memory subsystems,” said Bill Isaacson, senior director, product marketing at eSilicon. “This joint effort with Northwest Logic and SK Hynix validates that HBM is ready to enter mainstream use.”

Northwest Logic’s HBM Controller Core supports both Gen 2 (2 Gbit/s/pin) and Gen 1 (1 Gbit/s/pin). The core supports a range of user interfaces and operational modes include Gen 2 pseudo-channel support. As part of this demonstration, Northwest Logic created a complete FPGA design including the HBM Controller Core and FPGA PHY and memory test support.  This design provided error-free writes and reads to the HBM device.

“We are excited to collaborate with eSilicon and SK Hynix to show a fully working HBM demonstration,” commented Brian Daellenbach, president of Northwest Logic, Inc. “We are seeing increasing interest in HBM applications. This demonstration shows that eSilicon, Northwest Logic and SK Hynix have the capabilities needed to enable a customer to implement an HBM ASIC.”

“HBM utilizes the latest advancement in DRAM packaging and through-silicon via technologies to enable system designers to extract the maximum value in terms of performance and power efficiency from the DRAM memory subsystem.  SK Hynix is in the forefront of bringing the HBM device to the industry and anticipates adoption in multiple major market segments,” said Kevin Tran, senior manager of technical marketing at SK Hynix.

About e Silicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com

The right chip. Right now™

About Northwest Logic

Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (DDR4/3/2, LPDDR4/3/2 SDRAM; HBM, MRAM, RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit www.nwlogic.com.

About SK Hynix Inc.

SK Hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips ("NAND Flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.

eSilicon is a registered trademark, and the eSilicon logo and The right chip. Right now are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

 

 

 

 

Contacts:    
Sally Slemons Vinitha Seevaratnam Kevin Tran
eSilicon Corporation Northwest Logic SK Hynix
408-635-6409 503-533-5800 x308 408-232-8386
Email Contact www.nwlogic.com www.skhynix.com



Review Article Be the first to review this article
Featured Video
Jobs
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
Principal Engineer FPGA Design for Intevac at Santa Clara, CA
Sr. Staff Design SSD ASIC Engineer for Toshiba America Electronic Components. Inc. at San Jose, CA
ASIC FPGA Verification Engineer for General Dynamics Mission Systems at Bloomington, MN
SOC Logic Design Engineer for Global Foundaries at Santa Clara, CA
Upcoming Events
DVCon 2017 Conference at DoubleTree Hotel San Jose CA - Feb 27 - 2, 2017
IoT Summit 2017 at Great America ballroom, Santa Clara Convention Center Santa Clara CA - Mar 16 - 17, 2017
SNUG Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Mar 22 - 23, 2017
CDNLive Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Apr 11 - 12, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy