Industry's First Inductive Sensor IC Based Upon LVDT Architecture Implementations on PCBs Designed for Automotive and Industrial ApplicationsALISO VIEJO, Calif., July 30, 2015 — (PRNewswire) — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the first device in its new family of sensor interface integrated circuits (ICs) based upon inductive sensing technology. The LX3301A, the first inductive sensor IC in the market utilizing linear variable differential transformer (LVDT) architecture implementations on printed circuit boards (PCB), is designed for applications within the automotive and industrial markets.
Sensors are a key element in the feedback loop of virtually all closed-loop systems. With Microsemi's inductive sensing technology, the LX3301A sensor interface IC features LVDT principles, resulting in superior immunity to noise and interference. Microsemi's technology can also replace the incumbent Hall-effect sensors currently utilized in the marketplace, as these magnet-based sensors are susceptible to external magnetic fields and/or metal objects in close proximity. Inductive technology eliminates the magnet, thereby improving immunity to such interference.
"Microsemi is a market leader in inductive sensing technology, having supplied customized ICs in production for more than five years, and we are excited to expand our market opportunities with the LX3301A," said Shafy Eltoukhy, vice president and business unit manager at Microsemi. "Inductive sensing is an emerging technology which can replace Hall-effect sensing in a wide variety of mechanical motion sensing applications, and provides significant improvement in temperature stability, enhanced reliability and safety, and reduced system costs for our customers."
The new device is ideal for a variety of applications related to control systems and industrial automation, specifically linear displacement measurement (fluid level sensing, gear position for transmission actuator position and brake lamp switch/proximity detection) and angular motion measurement (robotic arm position, rotating shaft position, pedal position and rotary controls). It also meets strict automotive application requirements, including AECQ100-certified grade 1, ISO26262 compliance and production part approval process (PPAP) documentation support.
Additional features include:
- Contactless sensing (high reliability)
- Embedded 32-bit processing engine with 12kB program memory
- Two sensor input channels with integrated demodulator
- Internal oscillator with frequency range of 1 to 5 MHz
- Dual 13-bit ADC with sample rates to 2kHz
- User-programmable 16x16-bit non-volatile configuration memory
- Experienced automotive support team to ensure successful adoption
The implementation of sensors continues to expand throughout the automotive and industrial markets. For example, according to MEMS Journal, the number of new light vehicles (cars and light trucks) shipped worldwide will grow from approximately 85 million in 2014 to 110 million by 2020. These vehicles currently feature an average of 60-100 sensors on board, but as cars are rapidly getting "smarter," the number of sensors is projected to reach as many as 200 sensors per car. This translates to approximately 22 billion sensors used in the automotive industry per year by 2020.
The LX33xx sensor IC family can be used with Microsemi's motor drive reference design utilizing the SmartFusion®2 system-on chip (SoC) field programmable gate array (FPGA) and a motor control IP suite to process the sensor inputs and motor drive algorithms. The sensor inputs can be connected to the motor control evaluation board. For information, visit http://www.microsemi.com/applications/motor-control.
Microsemi's LX3301A is available now. For more information, visit http://www.microsemi.com/existing-parts/parts/136315 or email Email Contact.
About Microsemi's Automotive and Industrial Portfolio
Complementing its leadership in smart sensor interface technology, Microsemi is increasing its value as a systems solution provider with its new automotive-grade qualified SmartFusion2 and IGLOO®2 devices—offering advanced security and high reliability features critical for automotive applications. Microsemi's automotive and industrial portfolio also includes power discretes and modules, security software, Ethernet switches and PHYs, audio processors, Power-over-Ethernet (PoE), IEEE 1588 PLLs and software, clock management, component clocks, Wi-Fi RF ICs, and circuit protection devices. For more information about Microsemi's product portfolio for automotive and industrial applications, visit http://www.microsemi.com/applications/automotive and http://www.microsemi.com/applications/industrial.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the first device in its new family of standard product sensor interface ICs based upon inductive sensing technology, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
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SOURCE Microsemi Corporation
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