STMicroelectronics LSM6DS3 6-Axis IMU - 2015 Reverse Costing Analysis

DUBLIN, June 23, 2015 — (PRNewswire) —

Research and Markets( http://www.researchandmarkets.com/research/q4hzrw/stmicroelectronics) has announced the addition of the "STMicroelectronics LSM6DS3 6-Axis IMU - Reverse Costing Analysis" report to their offering.

600769

Combo sensors, and particularly 6-axis IMU, will represent the majority of the inertial MEMS market in the coming years according to Yole. This large adoption has not profited much to STMicroelectronics lately, but their latest innovation in the field could change that. Indeed, the LSM6DS3 has been named MEMS sensor device of the Year in 2014 and ST had a big design win with a 6-axis IMU in the Apple Watch this year.

By achieving 50% footprint reduction and decreasing considerably the power consumption compared to ST's previous generation IMU, the LSM6DS3 is ready to attack the mobile market where the competition on price is stronger than ever. In order to obtain this size of only 2.5x3x0.85mm, STMicroelectronics introduced many new features to its device. Indeed, the classical LGA 2-layer PCB has been replaced by an uncommon 3-layers PCB, the MEMS gyro and accelerometer have also been redesigned to be able to shrink the die size. On the processes side, new techniques borrowed from competitors products has been introduced in the MEMS fabrication and also a whole new process for the ASIC is now used allowing to embed 8KB of FIFO memory.

The LSM6DS3 is targeted for battery-powered smart sensor systems to be embedded in mobile and wearable devices and innovative objects for the Internet of Things (IoT).

The report includes a detailed technology and cost comparison with ST's previous generation LSM6DS0 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-6500).

Key Topics Covered:

1. Overview / Introduction

2. STMicroelectronics Company Profile

3. Physical Analysis

4. Physical Analysis Methodology
- Package
- Package Characteristics Marking & Pin-out
- Package Opening & Wire Bonding Process
- Package Cross-Section
- ASIC Die
- View, Dimensions & Marking
- Delayering & Main Blocks Identification
- Process Identification
- Cross-Section
- MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pads Details
- Cap Removed & Cap Details
- Sensing Areas Details
- Cross-Section (Sensor, Cap & Sealing)
- Process Characteristics

5. Technology comparison with STMicroelectronics LSM6DS0, Bosch Sensortec BMI160 and InvenSense MPU-6500

6. Manufacturing Process Flow

7. Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Units
- Packaging Process Flow & Assembly Unit

8. Cost Analysis

9. Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End : Probe Test & Dicing Cost
- ASIC Wafer & Die Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per process steps
- MEMS Back-End : Probe Test & Dicing Cost
- MEMS Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test & Calibration Cost
- LSM6DS3 Component Cost

10. Price Analysis

11. ST Financial Results
- LSM6DS3 Selling Price Estimation

12. Cost & Price comparison with Bosch Sensortec and InvenSense 6-Axis IMUs

For more information visit http://www.researchandmarkets.com/research/q4hzrw/stmicroelectronics

Media Contact: Laura Wood , +353-1-481-1716, Email Contact

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/stmicroelectronics-lsm6ds3-6-axis-imu---2015-reverse-costing-analysis-300104831.html

SOURCE Research and Markets

Contact:
Research and Markets
Web: http://www.researchandmarkets.com




Review Article Be the first to review this article

ALDEC:

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Reverie: All That Glitters is not Past
More Editorial  
Jobs
Technical Support Engineer for EDA Careers at Freemont, CA
Technical Marketing Manager Valley for EDA Careers at San Jose, CA
Digital and FPGA Hardware Designer for Giga-tronics Incorporated at San Ramon, CA
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
Senior Physical Design Engineer for Ambiq Micro at Austin, TX
Upcoming Events
European 3D Summit 2017 at 3, parvis Louis Néel 38054 Grenoble France - Jan 23 - 25, 2017
3D Printing Electronics Conference at High Tech Campus 1, 5656 Eindhoven Eindhoven Netherlands - Jan 24, 2017
DesignCon 2017 at Santa Clara Convention Center Santa Clara CA - Jan 31 - 2, 2017
IPC/Apex Expo 2017 at San Diego Convention Center San Diego CA - Feb 14 - 16, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy