New HiperPFS-3 Power Factor Correction ICs from Power Integrations Target Light-Load Performance

Maintain High Efficiency and Power Factor Across the Load Range, yet Consume Just 60 mW at No-Load

SHANGHAI — (BUSINESS WIRE) — June 23, 2015 — Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced its HiperPFSTM-3 family of power factor correction ICs, which offer high power factor and high efficiency across the entire load range. Targeting applications with continuous power demands up to 405 W for universal input and 900 W for high-line, the ICs feature efficiency levels of better than 95% from 10% load to full load and consume less than 60 mW under no-load conditions. A power factor of above 0.92 is easily achievable at 20% load.

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The highly integrated HiperPFS-3 devices include the variable frequency CCM controller, high-voltage power MOSFET and a Qspeed™ low QRR boost diode. The new devices also employ an innovative means of controlling EMI without adversely affecting power factor at light loads. Poor system power factor at light load is caused by X capacitors that are used to reduce differential mode EMI being fed back to the AC line. HiperPFS-3 ICs incorporate a digital power factor-enhancing circuit that activates during light load conditions; this increases the compensation to overcome the reactance of X capacitors in the EMI filter, minimizing the phase angle difference between the input voltage and the current. Consequently, designers may increase the size of the X capacitors while minimizing or eliminating differential-mode chokes, thereby reducing EMI without degrading light load power factor performance. This results in a smaller, lower cost, EMI filter stage.

Comments Edward Ong, product marketing manager at Power Integrations: “Standby energy-use standards such as ErP Lot 6 have previously forced designers of PCs and other systems to include both a main PSU and standby power supply. The excellent light load efficiency of our new HiperPFS-3 ICs enables them to eliminate the standby power supply, saving components, design time, space and cost.”

Available for both high and low-line applications, HiperPFS-3 ICs cover a continuous output power up to 900 W. Thermally efficient eSIP-16 packaging simplifies heat sink mounting. Devices cost $1.27 in 10,000 piece quantities. For more information please visit http://www.power.com/products/hiperpfs-3.

About Power Integrations

Power Integrations, Inc. is a leading innovator in semiconductor technologies for high-voltage power conversion. The company’s products are key building blocks in the clean-power ecosystem, enabling the generation of renewable energy as well as the efficient transmission and consumption of power in applications ranging from milliwatts to megawatts. For more information please visit http://www.power.com.

Power Integrations, HiperPFS and the Power Integrations logo are trademarks or registered trademarks of Power Integrations, Inc. All other trademarks are the property of their respective owners.



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