Newly Qualified Products Are Only Devices in the Industry to Offer Advanced Security and High Reliability Features Critical for Automotive ApplicationsALISO VIEJO, Calif., June 10, 2015 — (PRNewswire) — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new automotive-grade field programmable gate arrays (FPGAs) and system-on-chip (SoC) FPGAs. The next-generation low power, flash-based FPGAs and ARM® Cortex®-M3 enabled SoC FPGAs have achieved AEC-Q100 grade 2 qualification, an industry standard specification that outlines the criterion for electronics components to ensure that end systems meet automotive reliability levels. The new automotive-grade qualified SmartFusion®2 and IGLOO®2 devices are the only devices in the industry to offer advanced security and high reliability features critical for automotive applications.
"Security and reliability are major concerns in automotive applications, and these devices assure the safety of our customers' design, data and hardware from tampering and cloning," said Bruce Weyer, vice president and business unit manager at Microsemi. "In addition, the devices' single event upset (SEU) immunity offers protection from neutron-induced firm errors, helping customers achieve zero defect rate—an essential requirement in the automotive industry."
Microsemi's new automotive grade flash-based SoCs and FPGAs build upon the company's long legacy of offering high reliability devices, which are supported through long product lifecycles. The new devices are the most suitable alternate to ASICs providing a low power, cost-effective, secure and reliable solution for automotive applications including advanced driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communication and electric/hybrid engine control units. In addition to AEC-Q100 certification, Microsemi offers its customers SEU immunity, award-winning security features and a secure supply chain.
The new devices are targeted for the rapidly growing automotive electronics segment, as well as the industry's growing demand for high reliability and security for zero defect and tamper-free applications.
"The automotive market for semiconductors is forecast to grow to $31.4 billion in 2015, from $29.4 billion in 2014, an increase of almost 7 percent," commented Colin Barnden, principal analyst at Semicast Research. "In comparison, we see the market for semiconductors in vehicle connectivity and ADAS growing at more than 20 percent in 2015. Microsemi's SmartFusion2 and IGLOO2 devices bring world class security features to the automotive industry and will address several challenges such as hacking, malicious tampering and data theft faced by system designers in creating safe and secure systems for the connected automobile of the future."
About Microsemi's SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs are the only devices that address fundamental requirements for advanced security, high reliability and low power in critical industrial, military, aviation, communications and medical applications. SmartFusion2 integrates an inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM® CortexTM-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces all on a single chip. For more information visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2.
About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA market by providing a LUT-based fabric, 5G transceiver, high speed GPIO, block RAM, high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile Flash-based fabric with the highest number of general purpose I/O, 5G SERDES interfaces and PCIe end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry. For more information visit: http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new automotive-grade FPGAs and SoC FPGAs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
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SOURCE Microsemi Corporation
Farhad Mafie, VP Worldwide Product Marketing, 949-356-2399
Beth P. Quezada, Director, Corporate Communications, 949-380-6102