eSilicon's Javier DeLaCruz to Present: Cost Structure Advantages of 2.5D Integration

SAN JOSE, CA -- (Marketwired) -- Apr 29, 2015 --

Javier DeLaCruz, eSilicon's senior director of product strategy

IMAPS NE 42nd Symposium & Expo

Holiday Inn Conference Center
242 Adams
Boxborough, Massachusetts 01719

May 5, 2015
10:40 AM

Various market dynamics are influencing the adoption of 2.5D integration. Recent developments have enabled 2.5D to provide feature enhancements, but if applied well may also provide significant cost benefits over what can be otherwise executed.

About Javier DeLaCruz
As a senior director of product strategy at eSilicon Corporation, Javier DeLaCruz is responsible for roadmap development of enabling technologies. This includes 2.5D integration, IoT, advanced packaging and interface development. Before joining eSilicon, Javier held various technical and management positions at Multilink Technology Corp, STATS and M/A-COM. Javier holds a Bachelor of Engineering from Stevens Institute of Technology, a Masters of Science from Boston University and an MBA from Babson College.

About eSilicon
eSilicon, a leading independent semiconductor design and manufacturing solutions provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk, automated path to volume production. eSilicon serves a wide variety of markets including communications, computer, consumer, industrial products and medical.

eSilicon -- Enabling Your Silicon Success™

eSilicon is a registered trademark, and the eSilicon logo and Enabling Your Silicon Success are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

For more information, please contact:
Sally Slemons 
eSilicon Corporation 

Email Contact

Susan Cain 
Cain Communications 

Email Contact 

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