MEDIA ALERT: X-FAB to Exhibit, Introduce its Support for Cadence Digital Signoff Solutions, and Present at CDNLive EMEA 2015

ERFURT, Germany — (BUSINESS WIRE) — April 23, 2015X-FAB Silicon Foundries:

X-FAB Silicon Foundries, the world's leading full service foundry group for analog/mixed-signal semiconductor applications

Will share information next week at CDNLive EMEA – the Cadence® User conference in Munich, Germany – about how to achieve first-time-right success for analog/mixed-signal designs.

Joerg Doblaski, X-FAB’s Director for Design Support, and Thomas Ramsch, Director NVM Development, will be on hand in the Designer Expo area to discuss X-FABs recent advancements, including qualification and support for the Cadence Tempus Timing Signoff Solution and Cadence Voltus IC Power Integrity Solution; these solutions are fully compatible with all X-FAB process technologies and existing process design kits, and no re-characterization is needed. In addition, Melanie Wilhelm, Design Support Engineer, will present a paper, “Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Aware CPF Workflow.” It introduces the analog-on-top design flow with Common Power Format, and explains how X-FAB supports its fast and easy adoption.

CDNLive EMEA brings together a record number of Cadence technology users, developers, and industry experts to network, share best practices on critical design and verification issues and discover new techniques for designing advanced silicon, SoCs and systems.

Designer Expo, Booth #5:
Monday, Apr. 27, 12:00 – 13:30 and 17:45 – 20:00
Tuesday, Apr. 28, 12:30 – 13:30 and 17:30 – 18:30
Wednesday, Apr. 29, 7:30 – 8:30, 10:00 – 10:30 and 13:00 – 14:30

Presentation (Mixed-Signal Track):
Wednesday, Apr. 29, 8:30 – 9:00

Dolce Hotel Unterschleissheim
Andreas-Danzer-Weg 1,
85716 Unterschleißheim,
Munich, Germany

About X-FAB

X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt, Dresden and Itzehohe (Germany); Lubbock, Texas (U.S.); and Kuching, Sarawak (Malaysia); and employs approximately 2,500 people worldwide. Wafers are manufactured based on advanced modular CMOS, BiCMOS and MEMS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit


BiCMOS             Bipolar Complementary Metal Oxide Semiconductor
CPF             Common Power Format
CMOS             Complementary Metal Oxide Semiconductor
IC             Integrated Circuit
MEMS             Microelectromechanical Systems
SoC             System-on-Chip

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