Features include low off-state capacitance, low on-state resistance and high-voltage
TOKYO — (BUSINESS WIRE) — March 31, 2015 — Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced that it will expand its lineup of photorelays in the industry’s smallest package, VSON4, with the addition of six products that offer low off-state capacitance, low on-state resistance and high-voltage. These latest additions to the “TLP34xx series” start shipping today. By expanding the variation of voltage and “C x R”, the photorelays can support a variety of applications including semiconductor testers, measuring equipment and medical equipment.
Toshiba: Photorelays in Industry's Smallest Package (Photo: Business Wire)
The new products have the same electrical characteristics as Toshiba’s small-size package USOP4 series, but reduce required assembly area by approximately 50% by using the industry’s smallest package, VSON4. This can contribute to smaller and thinner products, and also makes it possible to significantly increase the number of photorelays on a circuit board without increasing its size.
The new line-up includes “TLP3442,” which realizes the industry’s lowest off-state capacitance (COFF), 0.3pF (typ.), and “TLP3431,” which is suited for use in high-frequency signal transmission with a low on-state resistance (RON) of 0.8ohm (typ.). The “TLP34xx series” provides a total system solution with a product line-up that covers both the low COFF and low RON range in an ultra-small VSON4 package.
Key Features of New Products:
- VSON4 package: Thickness 1.3mm (max), Area 1.5mm×2.5mm (max.)
- Trigger LED current: 3 mA (max)
- Isolation voltage: 300 Vrms (min.)
- Automatic Test Equipment (ATE)
- Measuring instruments
- Medical equipment
- Reed relay replacement
|Part No.||VOFF||ION||RON||COFF||C(pF)xR(Ω)||IOFF||tON||t OFF|