This solution ensures that ICs, packages and PCBs are optimized with each other to reduce package substrate and PCB costs by efficient layer reduction, optimized interconnect paths, and streamlined/automated control of the design process. The Xpedition Package Integrator product also provides the industry's first formal flow for ball grid array (BGA) ball-map planning and optimization based on an "intelligent pin" concept, defined by user rules. In addition, a groundbreaking multi-mode connectivity management system (incorporating hardware description language (HDL), spreadsheet and graphical schematic) provides cross-domain pin-mapping and system level cross-domain logical verification.
"Companies are recognizing that it will not be possible to design optimal systems in a timely fashion without the ability to co-design the IC, package, and board," said E. Jan Vardaman, president and founder, TechSearch International, Inc. "Incorporating key parameters from thermal and electromagnetic modeling will be critical in meeting performance objectives. Automating this process is essential to meet development and product launch schedules in our fast moving market segments. Mentor's Xpedition Package Integrator tool is a breakthrough in the design process."
Additional features include:
- Cross-domain interconnect visualization in a single view
- Powerful, comprehensive and user-friendly multi-mode physical layout tools with industry leading routing for PCB, MCM, SiP, RF, Hybrid and BGA designs
- Fully automated library development
The Xpedition Package Integrator flow leverages other Mentor Graphics tools such as the HyperLynx® signal and power integrity product, FloTHERM® computational fluid dynamics (CFD) thermal modeling tools, and the Valor® NPI substrate fabrication checking tool. To complete the Mentor Graphics co-design solution, Nimbic was acquired in 2014. The Nimbic technology provides Maxwell-accurate, 3D full-wave electromagnetic (EM) high-performance simulation solutions that accurately calculate complex electromagnetic fields for chip-package-board simulation.
"The Xpedition Package Integrator design flow, especially the unique virtual die model, gives package and board design experts really meaningful guidance and tools for their parts of the system design efforts," said Herb Reiter, president of eda2asic and Director of 3D-IC Programs at Si2. "This flow also allows quick and structured feedback to the IC designers and enables true die-package-board co-design and optimization towards best possible performance versus power ratios for your next system design."
"Mentor Graphics recognizes the increasing complexity in electrical systems design and manufacturing, particularly for IC, package and board co-design," stated A.J. Incorvaia, vice president and general manager of Mentor Graphics Systems Design Division. "Our new Xpedition Package Integrator flow will enable systems designers to achieve optimum productivity by saving time and costs while improving the overall quality and performance of advanced systems."
The Xpedition Package Integrator flow is available now. For pricing, consult a Mentor Graphics sales representative or call 1-800-547-3000. Additional product information can be found on the website: www.mentor.com/pcb/package-integrator
About Mentor Graphics
Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in excess of $1.24 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.
(Mentor Graphics, Xpedition, HyperLynx, FloTHERM and Valor are registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)
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SOURCE Mentor Graphics