Broadcom Extends Market Leadership with Industry's Lowest Power EDC PHY

Delivers 30 Percent Power Reduction to High Density Enterprise and Carrier Ethernet Systems

IRVINE, Calif., March 23, 2015 — (PRNewswire) — Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first 28 nanometer (nm) electronic dispersion compensation (EDC) physical layer transceiver (PHY) with support for long reach multimode (LRM). This latest addition to Broadcom's industry-leading portfolio of 1/10/40GbE physical layer devices delivers significant power savings while boosting performance. Broadcom will showcase its latest innovations for high speed interconnects at the OFC Technical Conference in Los Angeles, California, March 24-26. For more news, visit Broadcom's Newsroom.

Demand for increased bandwidth for processing and transmission of data is driving the need for higher performance and port density with lower power per port. Broadcom's new PHY provides a 30 percent reduction1 in power consumption together with an enhanced feature set and a flexible footprint-compatible migration path for enterprise and service provider networks seeking higher performance and greater bandwidth capacity.

"With increasing bandwidth and traffic demands being placed on the network, product migration to smaller geometries enabling reduced power consumption continues to be critical to our customers," said Lorenzo Longo, Broadcom, Vice President and General Manager, Physical Layer Products. "Broadcom is committed to continue investing in this technology to roll out lower power EDC/LRM PHY devices with advanced feature sets."

The BCM82780, based on EDC technology, enables 10/40GbE data transmission with LRM support. It also handles short range (SR), long range (LR) and extended range (ER and ZR) optical interfaces for added flexibility supporting a broad range of high-bandwidth applications. The multirate PHY is ideal for single mode fiber (SMF), multi-mode fiber (MMF) or copper twin-axial applications on the front panel. It features an all-DSP high-speed front end, which provides the highest performance and flexibility for line-card designers across 40GbE, 10GbE or 1GbE systems.

Key Features:

  • Octal 10GbE SFI-to-XFI/Dual 40GbE XLPPI-to-XLAUI EDC PHY
  • Low power: 400mW per full-duplex port
  • Supports 10GbE SR/LR/LRM/ER/ZR/DWDM/CR and 40GbE SR4/LR4/CR4
  • IEEE 1588 timestamping, Y.1731 with Sync-E recovered clock outputs
  • Integrated 2:1 failover switch in both transmit and receive directions
  • Advanced diagnostics on high-speed I/O including Eye-Mapping, SNR and BER
  • Fully compliant to KR and KR4 standards

The Broadcom BCM82780 is currently sampling.

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1 As compared to Broadcom's previous generation 40nm EDC/LRM devices

About Broadcom
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With one of the industry's broadest portfolio of state-of-the-art system-on-a-chip solutions, Broadcom is changing the world by Connecting everything®. For more information, go to

Broadcom®, the pulse logo, Connecting everything® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU.  Any other trademarks or trade names mentioned are the property of their respective owners.



Jyotsna Grover

Manager, Public Relations



T. Peter Andrew

Vice President, Treasury & Investor Relations


Sameer Desai

Director, Investor Relations



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SOURCE Broadcom Corporation; BRCM Infrastructure

Broadcom Corporation
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