Vicor Corporation Expands Its DCM(TM) DC-DC Converter Module Series

CHARLOTTE, NC -- (Marketwired) -- Mar 16, 2015 -- - APEC 2015 - Vicor Corporation (NASDAQ: VICR) today announced the expansion of the DCM Converter Module Series of isolated, regulated DC-DC converters within Vicor's Converter housed in Package™ (ChiP) power component platform. This series now covers critical applications in Aerospace, EV/HEV, Rugged Systems, Industrial, and Telecom/Datacom. DCMs provide nominal input voltages of 24, 28, 48, 270, 290, and 300 Volts with nominal outputs of 48, 36, 28, 24, 15, 12, and 5 Volts and are available in packages with up to 600 Watts of power.

DCMs can be coupled with Vicor FPA™ and/or ZVS regulators enabling full power solutions that deliver dense, efficient, and scalable source-to-load power. Designers can couple DCMs downstream with Vicor's ChiP and SiP (system in package) point-of-load regulators, thereby enabling an integrated, complete power solution. Such a combination of differentiated products, reflecting Vicor's Power Component Design Methodology, provides unsurpassed performance, ease of use, and total cost of ownership.

By utilizing Vicor's DC-ZVS topology within the DCM series, 93% typical efficiency can be achieved, along with power density exceeding two times that of conventional DC-DC converters. With power density up to 1,244 W/in3, DCMs enable engineers to optimize end systems for size, space, and weight. In addition, up to eight DCMs can be paralleled in an array without derating or additional circuitry. When configured in such an array, up to a 4.8 kW DC-DC solution can be achieved.

Vicor's DCMs are available in two through-hole packages: a 4623 (46 x 23 mm) ChiP package capable of up to 600 W of power and a 3623 (36 x 23 mm) ChiP package capable of up to 320 W of power.

About the Converter housed in Package (ChiP) Platform
Vicor's ChiP platform sets best-in-class standards for a new generation of scalable power modules. Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiPs provide superior thermal management supporting unprecedented power density. Thermally-adept ChiPs enable customers to achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably. The advent of ChiPs embodies a modular power system design methodology enabling designers to achieve high performance, cost-effective power systems from AC or DC sources to the point of load using proven building blocks.

Pricing and Availability
Pricing starts at $82.14 in 1,000 unit volumes for the 3623 ChiP packaged device. Visit the website for more information. To order, email custserv@vicorpower.com, call 1-800-735-6200 or visit us at www.vicorpower.com

Follow Vicor on Social Media
Twitter: @VicorPower
Vicor Corporation on LinkedIn
Vicor PowerBlog

About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the power source to the point of load. www.vicorpower.com

Vicor, DCM, Converter housed in Package, and FPA are trademarks of Vicor Corporation.

Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2783602

Colin Boroski 
Rainier Communications 
508-475-0025 x 142 

Email Contact 





Review Article Be the first to review this article
Featured Video
Editorial
More Editorial  
Jobs
Verification Engineer for Ambarella at Santa Clara, CA
Lead Java Platform Engineer IOT-WEB for EDA Careers at San Francisco Area, CA
Technical Support Engineer Germany/UK for EDA Careers at San Jose, CA
ASIC Design Engineer 2 for Ambarella at Santa Clara, CA
Engr, Elec Des 2 for KLA-Tencor at Milpitas, CA
ASIC Design Engineer for Ambarella at Santa Clara, CA
Upcoming Events
CDNLive Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Apr 11 - 12, 2017
10th Anniversary of Cyber-Physical Systems Week at Pittsburgh, PA, USA PA - Apr 18 - 21, 2017
DVCon 2017 China, April 19, 2017, Parkyard Hotel Shanghai, China at Parkyard Hotel Shanghai Shanghai China - Apr 19, 2017
Zuken Innovation World 2017 at Hilton Head Marriott Resort & Spa Hilton Head Island NC - Apr 24 - 26, 2017
S2C: FPGA Base prototyping- Download white paper



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy