Winbond Introduces 1Gb and 2Gb SpiFlash Memories in 8-Pin Package for Space-Limited Code-Storage Applications

SAN JOSE, Calif. & TAICHUNG, Taiwan — (BUSINESS WIRE) — March 11, 2015 — Winbond Electronics Corporation today announced a dramatic expansion of its Flash product portfolio with introduction of a new family of high-density SpiFlash® memories. The new family, the W25N Series, achieves both high-performance read of NOR Flash and the fast program-and-erase attributes of NAND Flash in a small 8-pin package. The new W25N Series also features the popular multi-IO SpiFlash interface and command set.

W25N Series SpiFlash Memory

Winbond – the world’s leading supplier of Serial Flash and NOR Flash, with 1.96 billion units shipped in 2014 – developed the new W25N Serial Flash series based on the well-established SpiFlash interface protocol and low-pin-count packages, to provide a seamless transition and higher-density coverage for Serial NOR Flash memory customers and leverage their existing SPI controller designs. Enabling customers to upgrade their software smoothly, Winbond is applying to these devices Continuous Read Operation with 52MB/s data transfer rate. Their features and performance are compatible with Serial NOR flash memory and ideal for code-shadowing applications.

To manage larger data more efficiently, the W25N Series features a page programming time of 250us and block-erase time of 2ms, which are 10 and 100 times faster, respectively, than those of conventional NOR Flash memories. As a result of faster program-and-erase operation, total power consumption for its completion is also reduced 10 and 100 times. Other features, such as embedded error-correction code and an on-chip bad-block management utility, improve the data integrity of the Flash memory and meet code-storage requirements. The W25N Serial flash series is available in densities starting at 1G-bit, with 8-pad WSON and 24-ball TFBGA packages. “We are extremely pleased with the interest that several major designers and manufacturers have shown in our new Serial Flash products, as well as with the initial success we’ve had ramping up this high density product family,” said John Park, president of Winbond Electronics Corporation America. “We are committed to providing long-term support to our customers with the Serial Flash families.”

The 1Gb Serial Flash memory is sampling now and will be available in production starting later this quarter. The 2Gb density Serial Flash device will be available starting 2Q’2015. For specific pricing on these products, please contact Winbond at

To assure satisfying growing global demand, all the new Winbond 46nm Serial Flash products are manufactured in Winbond’s 12-inch wafer fabrication facility in Taichung, Taiwan.

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include specialty DRAM, mobile DRAM, and Flash memories with Winbond’s memory business revenues in 2014 of more than US$1 billion. Winbond has approximately 2,200 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA. For more information, please visit:

SpiFlash is a registered trademark of Winbond Electronics Corporation. All other product names that appear in this material are for identification purposes only and are acknowledged trademarks or registered trademarks of their respective companies.


Marketing contact for Winbond SpiFlash Memories
Winbond Electronics Corp. America
Krishna Shekar, 1-408-474-1610
Senior Director of Flash Memory Marketing
Email Contact
Editorial contact for Winbond SpiFlash Memories
CommonGround Communications
Jerry Steach, 1-415-222-9996
Email Contact
Corporate spokesperson
James Wen, 886-3-5678168 #82507
Finance Center Vice President
Corporate news liaison
Li-Wen Wang, 886-3-5678168 #85300
Email Contact

Review Article Be the first to review this article

Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
H-1B Visa: de Geus’ tragedy looms large
Peggy AycinenaIP Showcase
by Peggy Aycinena
IP for Cars: Lawsuits are like Sandstorms
More Editorial  
Technical Support Engineer for EDA Careers at Freemont, CA
ASIC/FPGA Design Engineer for Palo Alto Networks at Santa Clara, CA
Lead Java Platform Engineer IOT-WEB for EDA Careers at San Francisco Area, CA
Mechanical Designer/Engineer for Palo Alto Networks at Santa Clara, CA
Technical Support Engineer EU/Germany/UK for EDA Careers at N/A, United Kingdom
Staff Software Engineer - (170059) for brocade at San Jose, CA
Upcoming Events
EDI CON China 2017! at Shanghai Convention & Exhibition Center of International Sourcing (SHCEC) No.2739 West Guangfu Road Putuo District, Shanghai (200062) China - Apr 25 - 27, 2017
2017 SEMICON Southeast Asia at SPICE Arena Penang Malaysia - Apr 25 - 27, 2017
2017 IoT Developers Conference at Santa Clara Convention Center California - Apr 26 - 27, 2017
Embedded Systems Conference ESC Boston 2017 at Boston Convention & Exhibition Center Boston MA - May 3 - 4, 2017

Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy