eSilicon Uses Sonics' Flagship On-chip Network in Complex SoC Design

MILPITAS, Calif., Feb. 24, 2015 — (PRNewswire) —   Sonics, Inc., the world's foremost supplier of on-chip network (NoC) technologies and services, today announced that eSilicon Corporation has completed tape out of a system-on-chip (SoC) design using SonicsGN® as the interconnect fabric. eSilicon selected SonicsGN to support its design requirements for rapid IP integration, high bandwidth with NoC throughput in the range of 500 GByte/sec, and ease of physical implementation and fast timing closure during place and route.

eSilicon is a leading independent semiconductor design and manufacturing solutions provider that delivers custom ICs and custom IP to OEMs, integrated device manufacturers (IDMs), fabless semiconductor companies (FSCs), and wafer foundries through a fast, flexible, lower-risk, automated path to volume production.

"The fact that eSilicon completed this complex SoC design project in just a few months speaks to the quality of SonicsGN as a key element in platform-based design," said Drew Wingard, CTO of Sonics. "The eSilicon design team leveraged SonicsGN's high level of automation and its rapid adaptability to address the extreme combination of high frequency and large physical dimensions in meeting its aggressive SoC schedule. We look forward to seeing the results in silicon of this important design project."

About Sonics, Inc.
Sonics, Inc. (Milpitas, Calif.) is the global leader in trusted on-chip network (NoC) technologies used by the industry's top semiconductor and electronics product companies. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Our comprehensive NoC portfolio delivers the communication performance required by today's most advanced consumer digital, communications and information technology devices. Sonics' NoCs are integral to the success of SoC design platforms that innovators such as Broadcom®, Intel®, Marvell®, MediaTek, and Microchip® rely on to meet their most demanding SoC integration and time-to-market requirements. We are a catalyst for design methodology change and actively drive industry conversation on the Agile IC LinkedIn group. Sonics' holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit, and follow us on Twitter at

Contact: Erica Harbison
McClenahan Bruer
Email Contact | 503.546.1013


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Sonics, Inc.

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