New software toolkit of solver technologies for studying the effects of EMC and EMI intrigues Editor at Large.
DUBLIN, NEW HAMPSHIRE, USA, Feb 20, 2015 — Desktop Engineering (deskeng.com) announces that the CST EMC STUDIO software for analyzing electromagnetic compatibility (EMC) and electromagnetic interference (EMI) using 3D electromagnetic field simulation from Computer Simulation Technology AG (CST; Darmstadt, Germany and Framingham, MA) is its Editor’s Pick of the Week for February 18, 2015.
“CST EMC STUDIO provides you with a toolkit of solver technologies for studying the effects of EMC, including radiated or conducted emissions and susceptibility to electrostatic discharge, lightning strikes and high-intensity radiated fields,” writes Anthony J. Lockwood, editor at large for Desktop Engineering. “The software’s solvers and tools are based on those used in the company’s CST STUDIO SUITE, probably CST’s best known application for electromagnetic simulation, as well as its CST BOARDCHECK program for EMC and signal integrity rule checking.”
“CST EMC STUDIO offers general-purpose 3D modules for time and frequency domain simulation as well as specialized solvers, including a 3D transmission line matrix method solver [that can] help simplify your numerical EMC analysis by using octree meshing to reduce simulation time on complex structures,” says Lockwood. “CST EMC STUDIO includes a cable harness solver [that] offers bidirectional coupling between it and the time domain solvers, [and its] rule checker [can] help you analyze imported printed circuit board layouts against a set of design rules.”
“For those of you who use CST DESIGN STUDIO, you’ll find that it increases the capabilities of CST EMC STUDIO’s 3D solvers with circuit simulation,” adds Lockwood. “[And it] also lets you link models through CST’s System Assembly and Modeling simulation project management environment [letting] you run simulations of hybrid systems made up of individual components.”
Read the full Editor’s Pick of the Week at “Software Analyzes Electromagnetic Compatibility and Interference.”
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