SAN JOSE, Calif. — January 7, 2015 — SEMI today announced a “Call for Papers” for SEMICON West, North AmericaÂ’s premier microelectronics event, to be held July 14-16 at the Moscone Center in San Francisco, Calif. The “Call for Papers” includes the Semiconductor Technology Symposium and the popular TechXPOT programs. Presentation abstracts are due March 20, 2015.
SEMICON West 2015 will be attended by nearly 27,000 semiconductor and related microelectronics industry professionals and feature more than 60 hours of technical sessions, led by the most informed and influential experts in the world. For 2015, SEMICON West will feature two “ Generation Next” Pavilions — a new concept in topic-based engagement, which will connect exhibits, technical sessions, and networking events to current, critical industry topics, engaging exhibitors and visitors in an immersive exhibition experience. In addition, the “standing-room only” success of the SEMICON West TechXPOT programs prompted the creation of the Semiconductor Technology Symposium (STS) at the 2014 event.
In 2015, the STS program continues with programs on leading-edge chip manufacturing held in a classroom setting with reserved seating adjacent to the show floor in the North Hall of Moscone Center. STS will offer technology trends, developments and new technology information in the areas of advanced materials and processing, lithography, metrology, 450mm, advanced packaging, and 3D-IC. Test Vision 2020, the leading semiconductor test conference focusing on ATE and high-volume manufacturing, is part of the STS program in Moscone Center.
TechXPOT programs in the Moscone Center North and South Halls will continue focusing on special topics in semiconductor manufacturing, and adjacent and related microelectronics technologies.
For the Semiconductor Technology Symposium, TechXPOTs, and Generation Next, SEMI is soliciting technical presentations in the following areas:
- Advanced lithography/Advanced films
- Advanced materials and processes
- Contamination control for advanced materials
- New and advanced metrology solutions
- Interconnect challenges at sub-10nm
- Substrates: Materials research beyond Silicon
- Other process implications for manufacturing next-generation transistors
- Accelerating and improving yield
- Silicon Photonics
- Disruptive compound semiconductor technologies
- Manufacturing advanced power semiconductors
- Improving Yield on Non-Planar ICs
- Failure analysis
- Advanced packaging
- Design for packaging
- Semiconductor test
- Design for test
- Application Level Testing
- Technologies for Emerging Markets & Applications
- WhatÂ’s next in MEMS?
- How manufacturing of IoT devices will impact IC fabrication
- How IoT and 3D printing will be used in IC manufacturing in the future
- Printed and flexible electronics
- Packaging of MEMS and Sensors
- SiP for Power and RF
- Heterogeneous Integration for SiP and Modules
“There are many exciting challenges facing the industry today,” said Karen Savala, President of SEMI Americas. “We are pleased that SEMICON West continues to serve as the premier forum where industry leaders share their insight on these issues.”
SEMICON West 2015 “Call for Participants”: Prospective presenters are invited to submit abstracts (maximum 500 words) on key industry issues and topics in the areas listed above for consideration. Presentations should focus on the latest developments and innovations in these technology areas, inclusive of supporting data. Submissions may be made online from the “Call for Participants” website at: www.semiconwest2015.org/callforpapers. The deadline is March 20.
“Generation Next” Pavilions (Advanced Substrate Engineering; Packaging): These two new Generation Next Pavilions will be held in conjunction with technical sessions (STS and TechXPOTs) at SEMICON West — addressing critical issues, challenges, and opportunities. For more information about exhibiting opportunities within these new Pavilions, contact Nick Antonopoulos at Email Contact or +1.408.943.6986.
Silicon Innovation Forum (SIF) “Call for Startups”: SEMI will host its 3rd Annual Silicon Innovation Forum at SEMICON West 2015 and is now accepting early applications to participate. The Silicon Innovation Forum (SIF) provides a stage for new and emerging innovators, industry leaders, strategic investors, and venture capitalists to discuss the needs and requirements of the industry’s innovation engine. Participants will gain insights into technology, capital, partnership, and collaboration strategies necessary for mutual success. For more information, please email Ray Morgan, director of Outreach at Email Contact. SIF application: 2015 SIF Showcase Request for Participation. The deadline is March 20.
About SEMICON West
SEMICON West is the flagship annual event for the global microelectronics industry, showcasing the people, products, and technologies driving the design and manufacture of advanced microelectronics. SEMICON West attracts the world's leading technology companies serving the microelectronics supply chain and the largest audience of influential buyers, industry leaders, decision-makers, technologists, analysts, and media of any industry event in North America. SEMICON West 2015 is projected to bring together more than 27,000 international attendees, more than 700 global companies, and feature more than 60 hours of technical, business, and networking programs. For more information, visit www.semiconwest.org.
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
Email: Email Contact