Maxim Integrated MAX21000 - 3-Axis MEMS Gyroscope Technology Analysis

DUBLIN, Dec. 18, 2014 — (PRNewswire) — Research and Markets

( http://www.researchandmarkets.com/research/x8pgd6/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21000 - 3-Axis MEMS Gyroscope Technology Analysis" report to their offering.

http://photos.prnewswire.com/prnh/20130307/600769

Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.

The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.

Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35% reduction in silicon area for the MEMS die, enabling a significant cost advantage.

Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile application.

The Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis is also available, for more information please click on the link below.

Key Topics Covered:

Glossary

Overview/Introduction , Maxim Company Profile

Physical Analysis

Package

  • Package Views & Dimensions
  • Package Pin Out
  • Package Opening
  • Wire Bonding Process
  • Package Cross-Section

ASIC Die

  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
  • Process Characteristics

MEMS Die

  • View, Dimensions & Marking
  • Bond Pad Opening
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Sealing)
  • Process Characteristics

Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

For more information visit http://www.researchandmarkets.com/research/x8pgd6/maxim_integrated

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