SAN JOSE, CA -- (Marketwired) -- Dec 03, 2014 --
ProPlus Design Solutions, Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions
Will demonstrate NanoSpice Giga™, the first giga-scale SPICE simulator to handle memory circuits with more than one-billion elements with a pure SPICE engine and other FinFET-ready DFY solutions, during the China Semiconductor Industry Association (CSIA) ICCAD 2014 (Booth #1F39).
Phase 3, Hong Kong Science Park, Shatin, Hong Kong
Thursday and Friday, December 11 and 12, from 8:30 a.m. until 5:30 p.m.
Additionally, Dr. Lianfeng Yang, ProPlus' vice president of marketing, will give a talk titled, " A High-Performance SPICE Simulator for Analog and Memory Design and Verification," during the EDA and IP Forum December 12, at 2:20 p.m.
About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the SPICE modeling solutions leader and leading technology provider of giga-scale SPICE simulation and design for yield (DFY) applications, it provides unique DFY solutions integrating the most advanced device modeling, a high-performance parallel SPICE simulation engine and hardware-validated variation analysis technologies. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com.
BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
For more information, contact: Nanette Collins Public Relations for ProPlus Design Solutions (617) 437-1822 Email Contact