Institute also Will Present its Latest Results in Key Technologies and
Its Roadmap for Silicon Nano-technologies at Workshop
GRENOBLE, France – Nov. 13, 2014 – CEA-Leti will present 17 papers at the 2014 IEEE International Electron Devices Meeting (IEDM) Dec. 15-17 in San Francisco, Calif. The total is the most ever for Leti and it includes four invited papers.
See PDF for paper abstracts, presenters and other details.
Leti also will host a Dec. 14 workshop for invited guests to present its latest high-level results in key technologies and its roadmap for silicon nanotechnologies in the next 10 years. Discussions, networking and cocktails will follow these presentations.
The devices workshop from will include summaries of:
- Leti’s innovative route with industry
- Emerging material for future market opportunities
- Leti’s vision towards 10nm and below
- CoolCubeTM, a powerful approach for further 3D VLSI scaling
- Embedded NVM for the future
- Going further with disruptive designs and architectures
- Electronic medicine: a new market needing new medical methodologies
About CEA-Leti (France)
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Visit www.leti.fr for more information. Follow us on www.leti.fr and @CEA_Leti.
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