Higher Circuit Densities Will Bolster the Global Mixed Signal SoC Market: TechNavio

LONDON — (BUSINESS WIRE) — October 31, 2014 — The Global Mixed Signal SoC Market is growing at a CAGR of 12.75 percent from 2014-2018, says research firm TechNavio.

About the Report

The latest report by TechNavio focuses on the increase in chip density as a main growth driver for System-on-Chip (SoC) technology. The number of functions that an IC is able to perform has increased considerably, while the cost of the IC has decreased gradually because of high circuit densities.

“To keep pace with increasing levels of integration, designers and engineers are continuously developing new methodologies and techniques to manage more circuitry within the same area at the same cost. This has resulted in the emergence of a new methodology called SoC design, wherein predesigned and pre-verified blocks such as IP blocks, IP cores, and virtual components are combined on a single chip,” says Faisal Ghaus, Vice President of TechNavio.

“Currently, more than 85 percent of SoCs are mixed signals, and these contain both digital and analog circuits. This has provided SoC manufacturers with a platform to reduce the size of the IC, and also integrate a large number of functions on a single IC, which can handle many application-specific processing functions.”

Key Information Covered in the Report:

  • Market segmentation, size and forecast through 2018
  • Market Growth Drivers:
  • Market Challenges:
  • Market Trends:
    • Convergence of Many Applications onto a Single Platform
    • For a full detailed list, view our report.
  • Key Vendors:
    • Broadcom Corp.
    • Freescale Semiconductor Ltd.
    • Infineon Technologies AG
    • Intel Corp.
    • Qualcomm Inc.
    • Texas Instruments Inc.
  • Other Prominent Vendors:
    • Altera
    • ARM Holdings
    • Marvell Technology Group
    • STMicroelectronics

TechNavio currently has more than 3000 market research reports on a huge range of topics, including 200+ reports on the mixed signal devices:

If you are interested in more information, please contact our media team at media@technavio.com.



Contact:

TechNavio Research
Jes Ellacott, US: +1 630-333-9501
UK: +44 208 123 1770
Media & Marketing Executive
www.technavio.com
Email Contact




Review Article Be the first to review this article
Featured Video
Jobs
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
ASIC FPGA Verification Engineer for General Dynamics Mission Systems at Bloomington, MN
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
SOC Logic Design Engineer for Global Foundaries at Santa Clara, CA
Technical Marketing Manager Valley for EDA Careers at San Jose, CA
Principal Engineer FPGA Design for Intevac at Santa Clara, CA
Upcoming Events
DVCon 2017 Conference at DoubleTree Hotel San Jose CA - Feb 27 - 2, 2017
IoT Summit 2017 at Great America ballroom, Santa Clara Convention Center Santa Clara CA - Mar 16 - 17, 2017
SNUG Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Mar 22 - 23, 2017
CDNLive Silicon Valley 2017 at Santa Clara Convention Center Santa Clara CA - Apr 11 - 12, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy