Dr. Lianfeng Yang, vice president of marketing at ProPlus Design Solutions, Inc., the SPICE modeling solutions leader and provider of the first giga-scale SPICE simulator and unique Design-for-Yield (DFY) solutions
Will deliver a talk along with other industry luminaries on semiconductor technology modeling, from processes to devices simulation and compact models up to parameter extraction during the 2014 International Conference on Computer-Aided-Design (ICCAD). Dr. Yang's talk is titled, "SPICE Modeling Challenges, Solutions and Its Impact to Advanced IC Designs."
Sunday, November 2, from 8 a.m. until 6 p.m.
Hilton San Jose, San Jose, Calif.
The workshop is complimentary to the first 50 registrants. Regular workshop fees will apply once registration has reached 50 attendees.
For information about ICCAD, visit: www.iccad.com
About ProPlus Design Solutions
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. As the SPICE modeling solutions leader and leading technology provider of giga-scale SPICE simulation and design for yield (DFY) applications, it provides unique DFY solutions integrating the most advanced device modeling, a high-performance parallel SPICE simulation engine and hardware-validated variation analysis technologies. Founded in 2006, ProPlus Design Solutions has R&D centers in the San Jose, Calif., Beijing and Jinan, China, and offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com.
BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
For more information, contact: Nanette Collins Public Relations for ProPlus Design Solutions (617) 437-1822 Email Contact