Toshiba Launches Automotive Infotainment Companion Chip Supporting High-Resolution Multimedia Connectivity and Camera Devices

TOKYO — (BUSINESS WIRE) — October 24, 2014Toshiba Corporation (TOKYO:6502) today announced the launch of a key new addition to its extensive portfolio of solutions for the automotive market. The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.
Sample shipments start today, with mass production scheduled to start in Mar, 2015.

Toshiba: Automotive infotainment companion chip supporting high-resolution multimedia connectivity a ...

Toshiba: Automotive infotainment companion chip supporting high-resolution multimedia connectivity and camera devices (Photo: Business Wire)

The new chip supports the latest automotive Gigabit Ethernet AVB standard for a wide range of applications, such as front, rear and surround-view cameras, digital audio, and transferring high-resolution video content to head-unit and rear-seat entertainment systems. The TC358791XBG can also seamlessly interface with and support many leading-edge automotive application processors on the market, thanks to its USB 3.0 and MIPI® CSI-2 and DSI connectivity for both audio and video, and will support Automotive Electronics Council reliability specification AEC-Q100 (Grade 3).
The TC358791XBG can help reduce both time to market and overall system bill-of-materials costs for automotive infotainment systems.

The TC358791XBG can split one video input into two pictures and can simultaneously drive two high-resolution low-voltage differential signaling (LVDS) digital displays. Examples include head units, instrument clusters, and parking aid vision systems. The chip can also send high-resolution audio and video data from the host processor to multiple displays or other electronic control units in the car, and it has a High Definition Multimedia Interface (HDMI®) 1.4 receiver interface to allow connection of HDMI®-enabled devices to the application processor.

The new chip is housed in a FBGA257 15mm x 15mm package with 0.8 mm ball pitch. Additional features include differential CVBS (composite) interfaces for analog composite video sources, support for early back-up camera view (CVBS to LVDS), and ability to relay packetized IQ audio tuner data to the host via USB.

Infotainment and Driver Assistance applications


Main Specifications

Part Number   TC358791XBG
Input Interface HDMI® 1.4




Output Video Interface MIPI® CSI-2

LVDS Dual-link, Single-link

Bi-Direction Interface I2S, TDM



Source Voltage MIPI®: 1.2V


HDMI ® /USB2.0 : 3.3V

RGMII : 2.5V

LVDS/USB3.0 : 1.8V

I/O: 1.8V and 3.3V

Package   FBGA257 (15mm×15mm,0.80mm pitch)

1 | 2  Next Page »

Review Article Be the first to review this article


Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Acquiring Mentor: Four Good Ideas, One Great
More Editorial  
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
Upcoming Events
SEMICON Europe at Grenoble France - Oct 25 - 27, 2016
ARM TechCon 2016 at Santa Clara Convention Center Santa Clara CA - Oct 25 - 27, 2016
Call For Proposals Now Open! at Santa Clara Convention Center, Santa Clara, CA California CA - Oct 25 - 27, 2016
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
S2C: FPGA Base prototyping- Download white paper

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy