Toshiba Offers World's Smallest-Class e-MMC Embedded NAND Flash Memory Products

New Chips Utilize Cutting-Edge 15nm Process

IRVINE, Calif., Oct. 1, 2014 — (PRNewswire) —   Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a class of e-MMCTM [1] embedded NAND flash memory products that are among the world's smallest[2].The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm process technology and a controller to manage basic control functions for NAND applications into a single package.

Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16 gigabyte[3]  (GB) products begins today, with 8GB, 32GB, 64GB, and 128GB products to follow.

By utilizing the 15nm process technology, the new product's package size is approximately 26 percent smaller[4] than comparable Toshiba products[5] and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).

"With the introduction of 15nm-based e-MMC, Toshiba continues to demonstrate its leadership in NAND Flash and embedded memory solutions targeting mobile and wearable devices," noted Scott Beekman, director of managed NAND memory products for TAEC. "The small 11mm x 10mm package, supporting a wide range of densities, is well-suited for increasingly space limited applications."

Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage.  This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs.  Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products.

New Product Line-up

Product Name

Capacity

Category

Package

Mass Production

THGBMFG6C1LBAIL

8GB

Supreme

11.5x13x0.8mm

2Q, 2015 (Apr.-Jun.)

THGBMFG6C1LBAIT

8GB

Supreme

11x10x0.8mm

2Q, 2015 (Apr.-Jun.)

THGBMFG7C2LBAIL

16GB

Supreme

11.5x13x0.8mm

1Q, 2015 (Jan.-Mar.)

THGBMFG7C2LBAIW

16GB

Supreme

11x10x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFG7C1LBAIL

16GB

Premium

11.5x13x0.8mm

1Q, 2015 (Jan.-Mar.)

THGBMFG8C4LBAIR

32GB

Supreme

11.5x13x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFG8C4LBAIW

32GB

Supreme

11x10x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFG8C2LBAIL

32GB

Premium

11.5x13x0.8mm

1Q, 2015 (Jan.-Mar.)

THGBMFG9C8LBAIG

64GB

Supreme

11.5x13x1.2mm

1Q, 2015 (Jan.-Mar.)

THGBMFG9C8LBAIX

64GB

Supreme

11x10x1.2mm

1Q, 2015 (Jan.-Mar.)

THGBMFG9C4LBAIR

64GB

Premium

11.5x13x1.0mm

1Q, 2015 (Jan.-Mar.)

THGBMFT0CBLBAIS

128GB

Supreme

11.5x13x1.4mm

2Q, 2015 (Apr.-Jun.)

*In Toshiba e-MMC categories, "Supreme" represents products suited to high-end class applications and "Premium" represents products for middle- and low-end class applications.

Key Features

  1. The JEDECe-MMC compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features <

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