Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many completely different ICs with different die sizes. FCI has created thousands of product and MPW designs for customers around the world, and partners with many Semiconductor manufacturers and foundries to enable them to test out hundreds of new IC designs and sample their customers with bumped ICs without going to the cost of creating individual mask sets for each new IC. FCI's ability to design, manufacture, and inspect a large number of MPW designs, as well as full-production designs, places them at the cutting edge of advanced Wafer Level Package development.
Doug Scott, FlipChip's Sr. Director of Engineering, said, "This is an important milestone for FlipChip, reaching the 250 MPW designs in such a short time frame. I'm very proud of the technical team at FCI in achieving this accomplishment. Our dedication to supporting the engineering requirements of all of our customers is an important strength of FCI. We strive to find the best technical solution for our customers, and we're very pleased to be such an important part of our customers' development strategy."
David Wilkie, FlipChip's CEO, said, "I'd like to congratulate the team for this important milestone. The dedication of the Engineering group in supporting customers around the world in finding the best technical solution to their wafer level packaging challenges remains a core strength of FCI. We're very proud of our engineering team, and we remain committed to supporting our customers at the highest technical levels."
FlipChip International – (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, AZ, and Shanghai, China.
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SOURCE FlipChip International