Maxim Integrated MAX21100 - 6-Axis MEMS IMU Reverse Costing Analysis

DUBLIN, September 22, 2014 — (PRNewswire) —

Research and Markets ( has announced the addition of the "Maxim Integrated MAX21100 - 6-Axis MEMS IMU Reverse Costing Analysis" report to their offering.

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With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.

The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.

Assembled in a LGA 3.0×3.0×0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.

The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.

Key Topics Covered:

1. Glossary

2. Overview/Introduction , Maxim Company Profile

3. Physical Analysis


  • Package Views & Dimensions
  • Package Opening
  • Wire Bonding Process
  • Package Cross-Section


  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
  • Process Characteristics


  • View, Dimensions & Marking
  • Bond Pad Opening
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Sealing)
  • Process Characteristics

Consumer 6-Axis IMU Comparison

4. Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

5. Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • MAX21100 Component Cost
  • Consumer 6-Axis IMU Cost Comparison

6. Estimated Price Analysis

For more information visit

Media Contact: Laura Wood, +353-1-481-1716, Email Contact

SOURCE Research and Markets

Research and Markets

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