Maxim Integrated MAX21100 - 6-Axis MEMS IMU Reverse Costing Analysis

DUBLIN, September 22, 2014 — (PRNewswire) —

Research and Markets ( http://www.researchandmarkets.com/research/drnqw4/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21100 - 6-Axis MEMS IMU Reverse Costing Analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

With the same process used for their 3-Axis gyro and acquired from the purchasing of SensorDynamics in 2011, the MAX21100 combines on only one MEMS die a 3-Axis gyroscope and a 3-Axis accelerometer.

The PSM-X2 technology platform used to build the sensor includes a proprietary surface micromachining process and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation and a dual pressure wafer-level capping of the sensors.

Assembled in a LGA 3.0×3.0×0.83mm package, the MAX21100 is a low power consumption (3.45mA) 3-Axis gyroscope plus 3-Axis accelerometer IMU with integrated 9-axis sensor fusion (6+3 DoF) targeted for consumer applications.

The report is including a detailed technical and cost comparison with state of the art 6-Axis MEMS IMUs (3-Axis gyroscope + 3-Axis accelerometer) from STMicroelectronics, Bosch Sensortec and InvenSense. Surprisingly, Maxim is able to provide a very competitive component due to an important silicon area reduction.

Key Topics Covered:

1. Glossary

2. Overview/Introduction , Maxim Company Profile

3. Physical Analysis

Package

  • Package Views & Dimensions
  • Package Opening
  • Wire Bonding Process
  • Package Cross-Section

ASIC Die 

  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
  • Process Characteristics

MEMS Die 

  • View, Dimensions & Marking
  • Bond Pad Opening
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Sealing)
  • Process Characteristics

Consumer 6-Axis IMU Comparison

4. Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

5. Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • MAX21100 Component Cost
  • Consumer 6-Axis IMU Cost Comparison

6. Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/drnqw4/maxim_integrated

Media Contact: Laura Wood, +353-1-481-1716, Email Contact

SOURCE Research and Markets

Contact:
Research and Markets




Review Article Be the first to review this article

Featured Video
Jobs
Design Verification Engineer for intersil at Morrisville, NC
ASIC Hardware Engineer for BAE Systems Intelligence & Security at Arlington, VA
Senior Electrical Engineer for Allen & Shariff Corporation at Pittsburgh, PA
Principle Electronic Design Engr for Cypress Semiconductor at San Jose, CA
Applications Engineer for intersil at Palm Bay, FL
Upcoming Events
IPC APEX EXPO 2018 at San Diego Convention Center San Diego CA - Feb 24 - 1, 2018
DVCon US 2018 at Double Tree Hotel San Jose CA - Feb 26 - 1, 2018
5th EAI International Conference on Big data and Cloud Computing Challenges at Vandalur, Kelambakkam high road chennai Tamil Nadu India - Mar 8 - 9, 2018



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise