TOKYO — (BUSINESS WIRE) — August 26, 2014 — Toshiba’s (TOKYO:6502) Logic LSI business solves the major problems custom LSIs face: development that takes over two years; costs that can become more expensive due to changes in application being developed or customer trends; and the expense of using cutting edge processes or devices. We propose FFSATM as a solution.
We have developed a solution for ApP Lite™ as a strategic product for controlling a series of movements of sensing, processing and uploading data to a cloud, and adding value to numerous data in the IOT, it’s market that has seen rapid growth in recent years. For example, we have launched products in such demand areas wearable devices that support healthy lifestyles and reduce risk of diseases, and set top box that receive video or audio services via the internet and wirelessly send them to PCs or smartphones.
We will provide solutions that help customers to overcome problems by extending these product lines.
FFSA™ (Fit Fast Structured Array)
We can realize highly functional, high performance SoC products offering low power consumption by using technologies licensed from Bay Sand Inc. in the US for customizing several metal mask layers. FFSA is compatible with FPGA, so we can offer prototype samples in only five weeks, 20% of the time required for traditional ASIC, using RTL design data verified by FPGA. It is also possible to provide prototype samples with the same pin out as FPGA. Reducing the number of customizing metal mask layers to just a few reduces development cost drastically, so it is no wonder that we are starting to receive orders from major network storage manufacturers in Japan and the US.
ApP Lite™ (Application Processor Lite)
By enhancing sensor technology and communications technology for transmitting sensor-collected data, we will achieve life-enriching IOT solutions. These will not simply upload sensed data to a cloud, but offer further value by adding signal processing, and image recognition, so as to reduce load for data communication. Our current line-up, including TZ1000, 2000, 3000, 5000 series targeting wearable devices, M2M wireless modules, IP-STB and more, are expected to see market growth. The key points of differentiation are lower power consumption, firm security functions and image/video sharpening technologies. We will make particular efforts to reinforce image/video sharpening technology with image recognition processors. We also utilize BLE (Bluetooth Low Energy) as well as Wi-Fi as communication technologies in ApP Lite cores. For TZ1000 and TZ2000, we will promote sales with a roadmap unified with our microcomputers, positioned not only as value-added models (power-saving application such as security, healthcare) but as ARM MCU+ communication functions.
We have accepted orders for Switch IC and 2 types of Bridge IC for a new smartphone currently being developed by Google Inc. This was due to a high evaluation of the implementation of the Unipro protocol (MIPI-related) owned by Logic LSI Division.
We will expand line-up of above products, collaborate with partners inside and outside of the company, improve technologies for sensors, data transmission and lower power consumption, and propose solutions in order to meet the customers' requests, including customization.
* FFSA™ and ApP Lite™ are trademarks of Toshiba.
Toshiba Corporation, a Fortune 500 company, channels world-class capabilities in advanced electronic and electrical product and systems into five strategic business domains: Energy & Infrastructure, Community Solutions, Healthcare Systems & Services, Electronic Devices & Components, and Lifestyles Products & Services. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations towards securing “Growth Through Creativity and Innovation”, and is contributing to the achievement of a world in which people everywhere live in safe, secure and comfortable society.
Founded in Tokyo in 1875, today’s Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide, with annual sales surpassing 6.5 trillion yen (US$63 billion).
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Semiconductor & Storage Products Company
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