Amar Hanspal joins eSilicon Board of Directors

Autodesk executive adds online market development experience

SAN JOSE, Calif. — July 1, 2014 — eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, today announced Amar Hanspal has joined its board of directors. Mr. Hanspal is currently senior vice president, Information Modeling and Platform Products Group at Autodesk. In this capacity, Hanspal oversees Autodesk's core cloud platform — Autodesk 360 — and the full range of Building Information Modeling products for the AEC Industry. He is also responsible for the Reality Capture and AutoCAD product families. He joined Autodesk in 1987 and has served in a variety of roles including VP of Autodesk Collaboration Solutions. Hanspal holds an MS degree in mechanical engineering from the State University of New York at Stony Brook and a BS degree in mechanical engineering from the University of Bombay.

"Amar brings a wealth of product and market development expertise to our board, much of it focused on web and cloud software," said Jack Harding, eSilicon's president and CEO. "eSilicon is creating new business models for the semiconductor industry by leveraging the Internet, and I am confident Amar will be a valuable addition to the team."

"I am impressed with the breadth of skills and track record of successful chip delivery at eSilicon," said Amar Hanspal. "The company also has an extensive commitment to automation, both from a business and technical perspective. I believe this technology, delivered through the web, is poised to transform how chips are designed, manufactured and delivered, and I look forward to being part of the team."

About eSilicon

eSilicon, a leading independent semiconductor design and manufacturing solutions provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments.


Sally Slemons
eSilicon Corporation
Email Contact

Susan Cain
Cain Communications
Email Contact

Review Article Be the first to review this article


Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Acquiring Mentor: Four Good Ideas, One Great
More Editorial  
Sr. staff ASIC Design Engineer -2433 for Microchip at San Jose, CA
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
SENIOR ASIC Design Engineer for TiBit Communications at Petaluma, CA
Upcoming Events
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
2016 International Conference On Computer Aided Design at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
ICCAD 2016, Nov 7-10, 2016 at Doubletree Hotel in Austin, TX at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
Electric&Hybrid Aerospace Technology Symposium 2016 at Conference Centre East. Koelnmesse (East Entrance) Messeplatz 1 Cologne Germany - Nov 9 - 10, 2016
S2C: FPGA Base prototyping- Download white paper
TrueCircuits: UltraPLL

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy