UltraComm X80 Fury Transceivers Validate Sustained 5G Performance for Microsemi's Leading Mainstream SmartFusion2 SoC FPGAs and IGLOO2 FPGAsALISO VIEJO, Calif., June 19, 2014 — (PRNewswire) — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its customer Ultra Communications (UltraComm), an innovative developer of highly compact and robust photonic components for harsh environment applications, has successfully interoperated its X80 Fury transceivers with Microsemi's SmartFusion®2 SoC FPGAs and IGLOO®2 FPGAs, validating the robustness of its mainstream SERDES transceivers.
In selecting Microsemi SmartFusion2 SoC FPGAs and IGLOO2 FPGAs for this interoperability exercise, UltraComm has achieved the goal of broadening the solution ecosystem for its ruggedized transceivers that maximize component density, performance and I/O functionality to meet the strict requirements of next-generation defense and commercial aviation applications.
"The fact that UltraComm, an innovator of leading-edge ruggedized subsystems for high reliability and high availability applications, has selected Microsemi's SmartFusion2 SoC FPGA and IGLOO2 FPGA families to conduct interoperability testing is an extremely valuable benchmark for customers," said Shakeel Peera, senior director of SoC product line marketing at Microsemi. "In less than a year after its launch, and 1,500 active customer engagements later, SmartFusion2 and IGLOO2 continue their upward trajectory with tremendous market acceptance. The successful UltraComm tests are further validation of the benefits SmartFusion2 and IGLOO2 mainstream features deliver."
Independent interoperability tests by UltraComm have proved the strength of Microsemi's SmartFusion2 and IGLOO2 SERDES for applications that require the highest reliability, lowest power and highest security. These tests demonstrate the value of integrating Microsemi's FPGAs and UltraComm's breakthrough optical module-based transceivers in defense and commercial aviation systems giving developers the ability to increase performance while reducing size, weight and power (SWaP) to achieve lower total cost-of-ownership advantages and deliver unrivaled security and reliability. The complete test report fiber optic documentation is available online at www.microsemi.com/ultracomm-interop-report.
"The successful interoperation between SmartFusion2 and IGLOO2 SERDES along with UltraComm's X80 Fury transceivers gives our mutual customers in the mission-critical defense and aviation markets a platform upon which to build a high reliability end-to-end fiber optic-based data transport solution," said Chuck Tabbert, vice president, sales & marketing at UltraComm. "Our leading X80 platform excels at providing a rugged transceiver for harsh fiber optic environments."
Customers in diverse markets can readily take advantage of the unique differentiation Microsemi's FPGA family offers, including the estimated $250 million defense and aviation market segment that can use this class of products. According to an IHS Technology Q4 2013 report, the military and civil aerospace total available market is approximately $500 million.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
About Ultra Communications
Ultra Communications (UltraComm) supplies highly compact and robust photonic components for harsh environment applications, such as satellites, military airframes, UAV, missiles and cell phone base station applications. We have developed a hybrid IC and optoelectronic integration approach that features: Standard planar manufacturing of photonic packages, Single chip integration of multiple functions—transmitters, receivers and built-in-test, high speed digital (12.5 Gbps) or RF photonic components, ability to optically monitor Vertical Cavity Surface Emitter Lasers (VCSEL) on a per-channel basis, high resolution OTDR ASICs, and operation over a wide temperature range and in radiation environments. Ultra Communications is headquartered in Vista, California (in the greater San Diego area). Additional information is available on the web at www.ultracomm-inc.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its customer Ultra Communications (UltraComm) successfully interoperating its x80 Fury transceivers with Microsemi's IGLOO2 FPGAs and selecting Microsemi SmartFusion2 SoC FPGAs and IGLOO2 FPGAs for its interoperability exercise, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
SOURCE Microsemi Corporation
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