STATS ChipPAC Conferred Singapore’s Prestigious Distinguished Partner in Progress Award

Singapore  April 28, 2014 –- STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services, today announced that it has received Singapore’s highly exclusive and prestigious honour, the Distinguished Partner in Progress (DPIP) award, in recognition of its strong leadership and outstanding contributions to the local semiconductor industry. Singapore Deputy Prime Minister and Coordinating Minister for National Security & Minister for Home Affairs, Mr. Teo Chee Hean, conferred the award to STATS ChipPAC during a ceremony held earlier today.

The DPIP award is an exclusive and prestigious corporate award initiated by the Singapore Economic Development Board (EDB) in 1991 to recognise companies for their contributions to Singapore’s economic growth and their commitment to promote the country’s social and community interests. Representing a diverse range of industries over the years, DPIP award recipients are local and global leaders in the markets they serve. STATS ChipPAC is the third homegrown Singapore company and first Outsourced Semiconductor Assembly and Test (OSAT) provider to receive the DPIP award.

“This award recognises STATS ChipPAC’s success as a local company that has helped to raise Singapore’s profile in the global semiconductor industry. Not only has STATS ChipPAC grown to become one of the largest and most innovative OSATs in the world, it has also helped to improve R&D capabilities among our research institutes, institutes of higher learning and other companies in the local semiconductor ecosystem. We are appreciative of STATS ChipPAC’s commitment to Singapore as its home for business and innovation,” said Mr. Leo Yip, Chairman, Singapore Economic Development Board.

Since its foundation in Singapore in 1994, STATS ChipPAC has transformed into a top tier OSAT company with more than 10,000 employees worldwide and a global manufacturing footprint that encompasses Singapore, South Korea, China and Taiwan.  With nearly 3,000 employees located in Singapore, STATS ChipPAC has invested approximately US$1.9 billion (S$2.4 billion) in Singapore to date to expand its technology offerings and manufacturing capacity.

“We are deeply honoured to receive the Singapore Government’s highly exclusive and prestigious corporate award. Our presence and investment in Singapore have grown tremendously over the last 20 years and today we are leading the semiconductor industry in a number of breakthrough technology and manufacturing achievements. From our technology leadership in fan-out wafer level packages to our new FlexLineTM manufacturing method, STATS ChipPAC is successfully driving innovation in advanced wafer level packaging for our customers,” said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC. 

Singapore is STATS ChipPAC’s corporate headquarters, worldwide hub for advanced wafer level technology R&D and high volume manufacturing for fan-in and fan-out wafer level packaging. 



Read the complete story ...


Review Article Be the first to review this article
Aldec

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Fall Schedule: A Host of Must-attends
More Editorial  
Jobs
Senior Front-End RTL Design AE for EDA Careers at San Jose, CA
DDR 3-4-5 Developer with VIP for EDA Careers at San Jose, CA
Senior R&D Engineer...Timing Closure Specialist for EDA Careers at San Jose or Anywhere, CA
Senior Methodology Automation Engineer for EDA Careers at San Jose, CA
Proposal Support Coordinator for Keystone Aerial Surveys at Philadelphia, PA
Upcoming Events
11th International Conference on Verification and Evaluation of Computer and Communication Systems at 1455 DeMaisonneuve W. EV05.139 Montreal Quebec Canada - Aug 24 - 25, 2017
The Rise of Mechatronics at Dassault Systèmes San Diego 5005 Wateridge Vista Drive San Diego CA - Sep 12, 2017
The Rise of Mechatronics at Buca di Beppo - Pasadena 80 West Green Street Pasadena CA - Sep 13, 2017
S2C: FPGA Base prototyping- Download white paper



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy