Singapore April 28, 2014 - STATS ChipPAC Ltd. (STATS ChipPAC or the Company SGX-ST: STATSChP), a leading provider of advanced semiconductor packaging and test services, today announced that it has received Singapores highly exclusive and prestigious honour, the Distinguished Partner in Progress (DPIP) award, in recognition of its strong leadership and outstanding contributions to the local semiconductor industry. Singapore Deputy Prime Minister and Coordinating Minister for National Security & Minister for Home Affairs, Mr. Teo Chee Hean, conferred the award to STATS ChipPAC during a ceremony held earlier today.
The DPIP award is an exclusive and prestigious corporate award initiated by the Singapore Economic Development Board (EDB) in 1991 to recognise companies for their contributions to Singapores economic growth and their commitment to promote the countrys social and community interests. Representing a diverse range of industries over the years, DPIP award recipients are local and global leaders in the markets they serve. STATS ChipPAC is the third homegrown Singapore company and first Outsourced Semiconductor Assembly and Test (OSAT) provider to receive the DPIP award.
This award recognises STATS ChipPACs success as a local company that has helped to raise Singapores profile in the global semiconductor industry. Not only has STATS ChipPAC grown to become one of the largest and most innovative OSATs in the world, it has also helped to improve R&D capabilities among our research institutes, institutes of higher learning and other companies in the local semiconductor ecosystem. We are appreciative of STATS ChipPACs commitment to Singapore as its home for business and innovation, said Mr. Leo Yip, Chairman, Singapore Economic Development Board.
Since its foundation in Singapore in 1994, STATS ChipPAC has transformed into a top tier OSAT company with more than 10,000 employees worldwide and a global manufacturing footprint that encompasses Singapore, South Korea, China and Taiwan. With nearly 3,000 employees located in Singapore, STATS ChipPAC has invested approximately US$1.9 billion (S$2.4 billion) in Singapore to date to expand its technology offerings and manufacturing capacity.
We are deeply honoured to receive the Singapore Governments highly exclusive and prestigious corporate award. Our presence and investment in Singapore have grown tremendously over the last 20 years and today we are leading the semiconductor industry in a number of breakthrough technology and manufacturing achievements. From our technology leadership in fan-out wafer level packages to our new FlexLineTM manufacturing method, STATS ChipPAC is successfully driving innovation in advanced wafer level packaging for our customers, said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC.
Singapore is STATS ChipPACs corporate headquarters, worldwide hub for advanced wafer level technology R&D and high volume manufacturing for fan-in and fan-out wafer level packaging.