Metrology, Inspection, and Process Control in VLSI Manufacturing

DUBLIN, April 11, 2014 — (PRNewswire) —

Dublin - Research and Markets ( http://www.researchandmarkets.com/research/gr7z43/metrology) has announced the addition of the "Metrology, Inspection, and Process Control in VLSI Manufacturing" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


The increase in complexity of semiconductors and the resulting increase in the complexity and cost of the semiconductor manufacturing process has been a driver of demand for metrology systems.

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented.

Market shares of competitors for all segment is presented.


Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Metrology/Inspection Technologies
3.1 Introduction
3.2 Imaging Techniques
3.2.1 Scanning Electron Microscope (SEM)
3.2.2 Transmission Electron Microscope (TEM)
3.3 Scanning Probe Microscopes
3.3.1 Atomic Force Microscopy (AFM)
3.3.2 Scanning Tunneling Microscopy (STM)
3.3.3 Scanning Probe Microscopy (SPM)
3.3.4 AFM Types
3.3.4.1 Contact AFM
3.3.4.2 Dynamic Force Mode AFM Techniques
3.3.5 Scanning Surface Potential Microscopy (SSPM)
3.4 Optical Techniques
3.4.1 Scatterometry
3.4.1.1 Ellipsometry
3.4.1.2 Reflectometry
3.4.1.3 Scatterometry Developments
3.4.2 Total Reflection X-Ray Fluorescence (TXRF)
3.4.3 Energy Dispersive X-Ray Analysis (EDX)
3.4.4 Secondary Ion Mass Spectrometry (SIMS)
3.4.4.1 Surface Imaging Using SIMS
3.4.4.2 SIMS Depth Profiling
3.4.5 Auger Electron Spectroscopy
3.4.6 Focused Ion Beam (FIB)
3.4.7 X-Ray Reflectometry (XRR)
3.4.8 X-Ray Photoelectron Spectroscopy (XPS)
3.4.9 Rutherford Backscattering (RBS)
3.4.10 Optical Acoustics Metrology
3.4.11 Fourier Transform Infrared Spectroscopy (FTIR)
3.4.12 Thermally-Induced Voltage Alteration (TIVA)
3.5 Film Thickness And Roughness
3.5.1 Surface Inspection Technology
3.5.2 Dimensional Technology
3.5.3 Stylus Profilometer

Chapter 4 Defect Review/Wafer Inspection
4.1 Introduction
4.2 Defect Review
4.2.1 SEM Defect Review
4.2.2 Optical Defect Review
4.2.3 Other Defect Review
4.3 Patterned Wafer Inspection
4.3.1 E-Beam Patterned Wafer Inspection
4.3.2 Optical Patterned Wafer Inspection
4.4 Unpatterned Wafer Inspection
4.5 Macro-Defect Inspection

Chapter 5 Thin Film Metrology
5.1 Introduction
5.1.1 Front End Applications
5.1.2 Back End Applications
5.2 Metal Thin-Film Metrology
5.3 Non-Metal Thin-Film Metrology
5.4 Substrate/Other Thin Film Metrology

Chapter 6 Lithography Metrology
6.1 Overlay
6.2 CD
6.3 Mask (Reticle) Metrology/Inspection

Chapter 7 Market Forecast
7.1 Introduction
7.2 Market Forecast Assumptions
7.3 Market Forecast

Chapter 8 Integrated/In-Situ Metrology/Inspection Trends
8.1 Introduction
8.2 In-Situ Metrology
8.3 Integrated Metrology
8.3.1 Benefits
8.3.2 Limitations

Chapter 9 Key Drivers
9.1 300mm/450mm Wafers
9.2 Copper Metrology
9.3 Low-K Dielectrics
9.4 Chemical Mechanical Planarization (CMP)
9.5 Ion Implant

For more information visit http://www.researchandmarkets.com/research/gr7z43/metrology


Media Contact: Laura Wood , +353-1-481-1716, Email Contact

SOURCE Research and Markets

Contact:
Research and Markets




Review Article Be the first to review this article
CST: Webinar November 9, 2017

Synopsys: Custom Compiler

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
DVCon Europe 2017: Munich and So much more
More Editorial  
Jobs
Technical Support Engineer EU/Germany/UK for EDA Careers at N/A, United Kingdom
Senior R&D Engineer...Timing Closure Specialist for EDA Careers at San Jose or Anywhere, CA
Senior Front-End RTL Design AE for EDA Careers at San Jose, CA
Upcoming Events
25th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC 2017) at Yas Viceroy Abu Dhabi Yas Marina Circuit, Yas Island Abu Dhabi United Arab Emirates - Oct 23 - 25, 2017
ARM TechCon 2017 at Santa Clara Convention Center Santa Clara CA - Oct 24 - 26, 2017
MIPI DevCon Bangalore 2017 at The Leela Palace Bengaluru India - Oct 27, 2017
MIPI DevCon Hsinchu City 2017 at Sheraton Hsinchu Hotel Taiwan - Oct 31, 2017
CST: Webinar series



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise