First announced just 3 months ago, the MachXO3 family puts affordable innovation into the hands of system architects by simplifying the implementation of evolving connectivity interfaces such as MIPI, PCIe, GbE, and others by matching advanced, small-footprint packaging with on-chip resources.
"What matters to us is size, cost and low-power consumption without compromising performance," said Devrin Talen, Systems Design Engineer at Vuzix Corp. "Lattice's MachXO3 devices have the right mix of LUT count, power consumption and I/Os needed to architect MIPI bridges that are capable of the high bandwidth and resolution requirements of our virtual and augmented reality systems."
The new uWatt power FPGA family provides a logic density range from 640-to-22K logic-cells. The family makes use of the latest in package technology to not only deliver tiny 2.5x2.5mm wafer-level chip-scale packaging, but also 540 I/O count devices, as well as devices with 3.125Gbps SERDES capabilities. The combination of features and more make the MachXO3 family the ideal choice to cover the full spectrum of bridging and interface requirements in consumer, industrial, communications, automotive, and compute markets.
The first samples of the MachXO3 family are supported by an advanced version of Lattice Diamond® software, as well as IP and application expertise both in-house and by third parties.
Pricing and Availability
Software availability and first production devices are available now. Pricing starts below $1.00 in high volume.
About Lattice Semiconductor
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Lattice Semiconductor Corporation, L (& design) Lattice Semiconductor (& design), Lattice (& design), L (& design), Lattice Diamond, MachXO3, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.
MIPI is a licensed trademark of MIPI, Inc. in the U.S. and other jurisdictions.
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