Intel Brings Supercomputing Horsepower to Big Data Analytics


  • Intel discloses form factors and memory configuration details of the CPU version of the next generation Intel® Xeon Phi™ processor (code named “Knights Landing”), to ease programmability for developers while improving performance.
  • Intel® Xeon® processor-based systems power more than 82 percent of all supercomputers on the recently announced 42nd edition of the Top500 list.
  • New Intel® HPC Distribution for Apache Hadoop* and Intel® Cloud Edition for Lustre* software tools bring the benefits of Big Data analytics and HPC together.
  • Collaboration with HPC community designed to deliver customized products to meet the diverse needs of customers.

DENVER — (BUSINESS WIRE) — November 19, 2013 — SUPERCOMPUTING CONFERENCE – Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.

“In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications,” said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. “Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions.”

Accelerating Adoption and Innovation

From Intel® Parallel Computing Centers to Intel® Xeon Phi™ coprocessor developer kits, Intel provides a range of technologies and expertise to foster innovation and adoption in the HPC ecosystem. The company is collaborating with partners to take full advantage of technologies available today, as well as create the next generation of highly integrated solutions that are easier to program for and are more energy-efficient. As a part of this collaboration Intel also plans to deliver customized HPC products to meet the diverse needs of customers. This initiative is aimed to extend Intel’s continued value of standards-based scalable platforms to include optimizations that will accelerate the next wave of scientific, industrial, and academic breakthroughs.

During the Supercomputing Conference (SC’13), Intel unveiled how the next generation Intel Xeon Phi product (codenamed “Knights Landing”), available as a host processor, will fit into standard rack architectures and run applications entirely natively instead of requiring data to be offloaded to the coprocessor. This will significantly reduce programming complexity and eliminate “offloading” of the data, thus improving performance and decreasing latencies caused by memory, PCIe and networking.

Knights Landing will also offer developers three memory options to optimize performance. Unlike other Exascale concepts requiring programmers to develop code specific to one machine, new Intel Xeon Phi processors will provide the simplicity and elegance of standard memory programming models.

In addition, Intel and Fujitsu recently announced an initiative that could potentially replace a computer’s electrical wiring with fiber optic links to carry Ethernet or PCI Express traffic over an Intel® Silicon Photonics link. This enables Intel Xeon Phi coprocessors to be installed in an expansion box, separated from host Intel Xeon processors, but function as if they were still located on the motherboard. This allows for much higher density of installed coprocessors and scaling the computer capacity without affecting host server operations.

Several companies are already adopting Intel’s technology. For example, Fovia Medical*, a world leader in volume rendering technology, created high-definition, 3D models to help medical professionals better visualize a patient’s body without invasive surgery. A demonstration from the University of Oklahoma’s Center for Analysis and Prediction of Storms (CAPS) showed a 2D simulation of an F4 tornado, and addressed how a forecaster will be able to experience an immersive 3D simulation and “walk around a storm” to better pinpoint its path. Both applications use Intel® Xeon® technology.

High Performance Computing for Data-Driven Discovery

Data intensive applications including weather forecasting and seismic analysis have been part of the HPC industry from its earliest days, and the performance of today’s systems and parallel software tools have made it possible to create larger and more complex simulations. However, with unstructured data accounting for 80 percent of all data, and growing 15 times faster than other data1, the industry is looking to tap into all of this information to uncover valuable insight.

Intel is addressing this need with the announcement of the Intel® HPC Distribution for Apache Hadoop* software (Intel® HPC Distribution) that combines the Intel <

1 | 2  Next Page »

Review Article Be the first to review this article


Featured Video
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Acquiring Mentor: Four Good Ideas, One Great
More Editorial  
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
SENIOR ASIC Design Engineer for TiBit Communications at Petaluma, CA
Upcoming Events
DeviceWerx - 2016 at Green Valley Ranch Casino & Resort Las Vegas NV - Nov 3 - 4, 2016
2016 International Conference On Computer Aided Design at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
ICCAD 2016, Nov 7-10, 2016 at Doubletree Hotel in Austin, TX at Doubletree Hotel Austin TX - Nov 7 - 10, 2016
Electric&Hybrid Aerospace Technology Symposium 2016 at Conference Centre East. Koelnmesse (East Entrance) Messeplatz 1 Cologne Germany - Nov 9 - 10, 2016
S2C: FPGA Base prototyping- Download white paper

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy