IEEE 1801™-2013 Designed to Improve Energy Efficiency of Electronic Devices

Revised standard focusing on low power intent and energy management in chip design made available for download at no charge through the IEEE Get ProgramTM

PISCATAWAY, N.J. — (BUSINESS WIRE) — May 29, 2013 —  IEEE, the world's largest professional organization advancing technology for humanity, today announced the publication of IEEE 1801™-2013 “Standard for Design and Verification of Low Power Integrated Circuits.” The standard, which was approved by one of the largest entity-based ballot groups in IEEE Standards Association (IEEE-SA) history, is intended to enhance and improve the energy efficiency of devices by focusing on low power intent (a specification of the planned power-management architecture for a given design) and energy management in chip design.

IEEE 1801-2013 is available immediately at no charge via the IEEE Get ProgramTM, which grants the public access to view and download certain current individual standards. To view and download IEEE 1801-2013, please visit the IEEE 1801-2013 Get Program Web page.

“It has been great to see so many companies participate in the development of this important revision to the standard, and I would like to thank the dedicated team of individuals without whose tireless hard work this would not have been possible,” said John Biggs, chair of the IEEE UPF: Standard for Design and Verification of Low Power Integrated Circuits Working Group. “Standards underpin our industry, and now that power is a primary design constraint, having a recognized standard for power intent is vital for continued growth.”

IEEE 1801 Unified Power Format (UPF) is designed to express power intent for electronic systems and components. IEEE 1801-2013, the revised version of the standard, is intended to provide users with more power, precision and flexibility in defining chip-level specifications.

“We’re getting into a world where everything is interconnected, and low power becomes a major factor in how this is going to be implemented. The future of interconnection depends on efficient energy consumption,” said Stan Krolikoski, chair of the IEEE Computer Society's Design Automation Standards Committee (DASC), which sponsored the standard revision project. “The IEEE 1801-2013 standard not only benefits the end user, but it also has an environmental aspect. It focuses on energy as consumed by the electronics, which is the power characterization of the electronic circuits.”

From power-hungry servers in data centers to the countless devices that contribute to the Internet of Things (IoT), electronic systems use vast amounts of energy every day. Management and control of energy usage through power gating and other related techniques has become mandatory in many electronic systems, both to minimize heat generation and to maximize battery life. Power management involves partitioning a design into independent power domains to enable different power modes that optimize power consumption for each functional mode of the design. The IEEE 1801-2013 standard offers a portable, vendor-independent format for defining the power-management architecture of a system for use in both verification and implementation aspects of the design flow.

“Power-aware design and verification methodology has been advancing rapidly in recent years, and UPF has evolved in parallel to reflect new concepts, methods and approaches,” said Erich Marschner, vice chair of the IEEE UPF working group. “IEEE 1801-2013 UPF is the latest step in this evolution, adding significant new capability, flexibility and precision for power-intent specifications. In the next few years, the IEEE UPF working group will continue to enhance UPF to address new requirements involved in moving up to even higher levels of abstraction, power modeling and power analysis.”

IEEE 1801 is a market-driven standard developed in the spirit of the “OpenStand” paradigm for global, open standards ( http://open-stand.org).

Along with the Association for Computing Machinery (ACM) and the Electronic Design Automation Consortium (EDA Consortium), IEEE is sponsoring the Design Automation Conference (DAC) 2-6 June 2013 at the Austin (Texas) Convention Center. The event is recognized as the premier event for the design of electronic circuits and systems, EDA and embedded systems and software (ESS). From 1 p.m. to 5 p.m. on June 2, DAC attendees will have the opportunity to attend the "Low-Power Design with the New IEEE 1801-2013 Standard" workshop, which covers an introduction to the low power design intent concepts and methodologies fundamental to IEEE 1801. For more information on the DAC, please visit http://www.dac.com.

For more information about the IEEE UPF working group, please visit http://standards.ieee.org/develop/wg/UPF.html.

For more information about IEEE DASC, please visit http://www.dasc.org.

To learn more about IEEE-SA, visit us on Facebook at http://www.facebook.com/ieeesa, follow us on Twitter at http://www.twitter.com/ieeesa, connect with us on LinkedIn at http://www.linkedin.com/groups?gid=1791118 or on the Standards Insight Blog at http://www.standardsinsight.com.

About the IEEE Standards Association

The IEEE Standards Association, a globally recognized standards-setting body within IEEE, develops consensus standards through an open process that engages industry and brings together a broad stakeholder community. IEEE standards set specifications and best practices based on current scientific and technological knowledge. The IEEE-SA has a portfolio of over 900 active standards and more than 500 standards under development. For more information visit http://standards.ieee.org/.

About IEEE

IEEE, a large, global technical professional organization, is dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers and telecommunications to biomedical engineering, electric power and consumer electronics. Learn more at http://www.ieee.org .

1 | 2  Next Page »



Review Article Be the first to review this article

EMA:

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Retail Therapy: Jump starting Black Friday
Peggy AycinenaIP Showcase
by Peggy Aycinena
REUSE 2016: Addressing the Four Freedoms
More Editorial  
Jobs
Principal Circuit Design Engineer for Rambus at Sunnyvale, CA
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
AE-APPS SUPPORT/TMM for EDA Careers at San Jose-SOCAL-AZ, CA
Manager, Field Applications Engineering for Real Intent at Sunnyvale, CA
ACCOUNT MANAGER MUNICH GERMANY EU for EDA Careers at MUNICH, Germany
Upcoming Events
2016 IEEE International Electron Devices Meeting at Hilton San Francisco Union Square 333 O’Farrell Street San Francisco CA - Dec 3 - 7, 2016
Zuken Innovation World 2017, April 24 - 26, 2017, Hilton Head Marriott Resort & Spa in Hilton Head Island, SC at Hilton Head Marriott Resort & Spa Hilton Head Island NC - Apr 24 - 26, 2017
CST Webinar Series



Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy