EL SEGUNDO, Calif. – April 29, 2013 – AWR Corporation, the innovation leader in high-frequency EDA software, today announced the start of its AWR Design Forum 2013 tour with a diverse schedule of dates and venues in the Asia Pacific region starting this summer. ADF is an open event at which designers of microwave and RF circuits and systems such as MMIC, RF PCB, and LTE can network and share useful information and resources pertinent to high-frequency design, discuss AWR products and technologies, and collaborate on industry issues and trends. Details are available at http://www.awrcorp.com/ADF2013.
Locations and Dates:
- Seoul, Korea - July 8, 2013
- Tokyo, Japan - July 12, 2013
- Nanjing, China - September 4, 2013
- Shanghai, China - September 5, 2013
- Taipei, Taiwan - September 10, 2013
Call for Papers:
ADF also provides an opportunity for the presentation of interesting and informative papers from customers and partners working in the microwave & RF industry, as well as from research and educational institutions. The Call for Papers is now open and suggested topics include but are not limited to MMIC design, communications system and radar simulation, microwave components, RF and microwave circuit boards, and RF SoCs, SiPs, and modules. All presentations will be made available for download from the AWR website after the event concludes. Additionally, speaker gifts and a lucky draw will be provided. For deadlines and more information, visit http://www.awrcorp.com/ADF2013/call-papers.
AWR, the innovation leader in high-frequency EDA software, dramatically reduces development time and cost for products employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications.
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