A single TTC-1001 chip is referred to as a 'unit cell' and. has a single 10 Ohm resistor covering nearly 70% of the cell area and a single diode for temperature measurement in the center of the chip. Wafers (6") contain more than 8,000 unit cells and may be purchased in wire bond or bumped configuration. Wafers may also be customized to include different thicknesses, surface finishes, backside metal, and array sizes.
Arrays of unit cells may be created to simulate different sizes of operational semiconductor devices. For wire bond wafers, the resistors are connected between unit cells in one direction. The diodes are connected between unit cells in a matrix configuration that allows single diode addressing by selection of X and Y-oriented connections. For bumped wafers, there is no cell-to-cell interconnection, providing the user with the ability to perform non-uniform heating of an array.
Contact TEA for order, delivery, and technical information on the TTC-1001.
About Thermal Engineering Associates:
TEA and its president, Bernie Siegal, have been providing thermal test and measurement hardware, software, and consulting services since 1973. Siegal has been chairman of the JEDEC JC15 committee and is the principle author of many MILSTD 750 thermal test methods. All major semiconductor companies, packaging companies, and many system level OEMs have utilized TEA products and/or services during its long history. Siegal is a founding member of IEEE SEMI-THERM, has delivered numerous papers and articles on thermal testing, and is frequently sought out as a lecturer and expert in the field. For more information on products and services, go to www.thermengr.com.
SOURCE Thermal Engineering Associates, Inc.
|Thermal Engineering Associates, Inc.