At EDSFair, Docea Highlights Solutions to Optimize Dynamic Thermal Management at Architectural Level. Holds Seminars.

November 14-16, 2012, Pacifico, Yokohama, Japan

YOKOHAMA, Japan — (BUSINESS WIRE) — November 13, 2012Who/What
Docea Power, a leading provider of software products for power architects, will exhibit at the Electronic Design and Solution Fair 2012 ( EDSFair), November 14 to 16, at Pacifico, in Yokohama, Japan.

Docea’s products enable early power architecture exploration, power budget tracking during the entire design process, and faster verification and debug of power and thermal management software.

Docea and its partner in Japan, HDLAB, will offer continuous demonstrations of its latest releases of Aceplorer and AceThermalModeler at booth ECA-004.

Aceplorer offers a unique framework for Power Architects who need a solution to

  • Perform early power exploration on new architectures and efficiently address RFQs and requests for change during the project life,
  • Track power budgets at both SoC and chipset levels during the design phases,
  • Explore and optimize dynamic power and thermal management strategies for complex devices
  • Provide software and validation teams with a reference model for faster power and thermal management software validation and debug and a secure time to market.

AceThermalModeler generates compact RC thermal models that can be used in Aceplorer for coupled power and thermal simulations, both for steady state and transient use cases. The combination of both tools optimizes dynamic thermal management at the architectural level.


Docea Power will hold seminars titled: How to model and optimize your thermal and power management policy for next generation design at the system level and Dynamic power and thermal management modeling and simulation with Aceplorer and AceThermalModeler.

The seminars will use an example that shows how to model power and thermal at the system level and how to simulate the coupling between power and thermal concerns for efficient exploration of dynamic thermal management.

Seminars dates:
Nov. 14, 2012, from 1 pm to 1.45 pm
Nov. 15, 2012, from 10 am to 10.45 am
More information on the seminars: please click here.

Booth # ECA-004
Pacifico Yokohama
Minato Mirai, Yokohama, Japan

Information and Registration
To schedule a meeting with Docea Power, please email Ridha.hamza (a) or call +33 (0)4 27 85 82 97.
For more information about Docea, please visit

About Docea Power
Docea Power develops and commercializes a new generation of methodology and tools for enabling faster and more reliable power and thermal modelling at the Electronic Systems Level (ESL). Docea’s solutions offer a consistent approach for architectural exploration and optimizing power and thermal behaviour of electronic systems, at an early stage of an electronic design project. Customers include manufacturers of electronic systems, chips and boards that target wireless, multimedia, consumer, networking and automotive applications. The company has offices near Grenoble, France, and in San Jose, California, USA, and sales offices in Japan and Korea. For more information:


Press contacts
Europe: Chantal Cochini, l’Ops PR,
+33(0)6 22 98 03 80, Email Contact
US: Georgia Marszalek, ValleyPR LLC,
+1 (650) 345-7477, Email Contact

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