At EDSFair, Docea Highlights Solutions to Optimize Dynamic Thermal Management at Architectural Level. Holds Seminars.

November 14-16, 2012, Pacifico, Yokohama, Japan

YOKOHAMA, Japan — (BUSINESS WIRE) — November 13, 2012Who/What
Docea Power, a leading provider of software products for power architects, will exhibit at the Electronic Design and Solution Fair 2012 ( EDSFair), November 14 to 16, at Pacifico, in Yokohama, Japan.

Docea’s products enable early power architecture exploration, power budget tracking during the entire design process, and faster verification and debug of power and thermal management software.

Docea and its partner in Japan, HDLAB, will offer continuous demonstrations of its latest releases of Aceplorer and AceThermalModeler at booth ECA-004.

Aceplorer offers a unique framework for Power Architects who need a solution to

  • Perform early power exploration on new architectures and efficiently address RFQs and requests for change during the project life,
  • Track power budgets at both SoC and chipset levels during the design phases,
  • Explore and optimize dynamic power and thermal management strategies for complex devices
  • Provide software and validation teams with a reference model for faster power and thermal management software validation and debug and a secure time to market.

AceThermalModeler generates compact RC thermal models that can be used in Aceplorer for coupled power and thermal simulations, both for steady state and transient use cases. The combination of both tools optimizes dynamic thermal management at the architectural level.

Seminar

Docea Power will hold seminars titled: How to model and optimize your thermal and power management policy for next generation design at the system level and Dynamic power and thermal management modeling and simulation with Aceplorer and AceThermalModeler.

The seminars will use an example that shows how to model power and thermal at the system level and how to simulate the coupling between power and thermal concerns for efficient exploration of dynamic thermal management.

When/Where
Seminars dates:
Nov. 14, 2012, from 1 pm to 1.45 pm
Nov. 15, 2012, from 10 am to 10.45 am
More information on the seminars: please click here.

Demonstrations
Booth # ECA-004
Pacifico Yokohama
Minato Mirai, Yokohama, Japan

Information and Registration
To schedule a meeting with Docea Power, please email Ridha.hamza (a)doceapower.com or call +33 (0)4 27 85 82 97.
For more information about Docea, please visit www.doceapower.com.

About Docea Power
Docea Power develops and commercializes a new generation of methodology and tools for enabling faster and more reliable power and thermal modelling at the Electronic Systems Level (ESL). Docea’s solutions offer a consistent approach for architectural exploration and optimizing power and thermal behaviour of electronic systems, at an early stage of an electronic design project. Customers include manufacturers of electronic systems, chips and boards that target wireless, multimedia, consumer, networking and automotive applications. The company has offices near Grenoble, France, and in San Jose, California, USA, and sales offices in Japan and Korea. For more information: www.doceapower.com.



Contact:

Press contacts
Europe: Chantal Cochini, l’Ops PR,
+33(0)6 22 98 03 80, Email Contact
or
US: Georgia Marszalek, ValleyPR LLC,
+1 (650) 345-7477, Email Contact




Review Article Be the first to review this article

ALDEC:

Featured Video
Editorial
Peggy AycinenaWhat Would Joe Do?
by Peggy Aycinena
Reverie: All That Glitters is not Past
More Editorial  
Jobs
Technical Support Engineer for EDA Careers at Freemont, CA
SoC Design Engineer for Intel at Santa Clara, CA
Development Engineer-WEB SKILLS +++ for EDA Careers at North Valley, CA
FAE FIELD APPLICATIONS SAN DIEGO for EDA Careers at San Diego, CA
Senior Physical Design Engineer for Ambiq Micro at Austin, TX
Digital and FPGA Hardware Designer for Giga-tronics Incorporated at San Ramon, CA
Upcoming Events
European 3D Summit 2017 at 3, parvis Louis Néel 38054 Grenoble France - Jan 23 - 25, 2017
3D Printing Electronics Conference at High Tech Campus 1, 5656 Eindhoven Eindhoven Netherlands - Jan 24, 2017
DesignCon 2017 at Santa Clara Convention Center Santa Clara CA - Jan 31 - 2, 2017
Embedded Neural Network Summit at San Jose CA - Feb 1, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy