If you missed any of the live broadcasts from Apache's educational webinar series, they are available on-demand. This is your opportunity for a deep-dive into solutions for hot topics including Ultra-Low-Power, Advanced Reliability, Chip-Package-System Convergence and 3D-IC Designs featuring real case studies and proven methodology techniques.

To register and watch the webinars, click here.

Apache launched a new microsite dedicated to CPS (www.apache-da.com/cps-solutions). Apache's CPS solution offers an integrated analysis and verification methodology that helps meet the challenges in chip, package and board design. The microsite consolidates all Apache CPS material in one place for enabling easy access to education of this critical methodology. The microsite contains technical material including white papers, conference papers, articles, blogs and webinars. The CPS microsite will be continually updated with new content as available, including topical material by industry experts.

• Learn from industry leaders about CPS through technical papers, presentations and webcasts.

• Read latest technical articles and view informative videos on CPS.

• Catch up on blogs covering CPS related topics.

• See how Chip-Package-System User Group is enabling collaboration across multiple design disciplines.

Click here to visit the CPS Solutions microsite.

Watch the video to learn more about how ANSYS and Apache are solving critical power challenges for today's smart electronics.

• Preparing for 3DX
• Design for Reliability – The Golden Age of Simulation Driven Product Design
• Smarter Co-design With Models
• 3D Thermal Analysis
• A Modeling Approach for Power Integrity Simulation in 3D-IC Designs
• Experts At The Table: Pain Points
• Apache Customers Speak About the Benefits of PowerArtist

• NEW: Optimizing Cost-Performance-Schedule with Chip-Package-System Methodology
• NEW: ANSYS and Apache Technologies for an Integrated Chip-Package-System Flow
• Advanced Modeling for Chip, Package, System Co-analysis/Co-optimization
• Electronic Power and Thermal Management
• RTL Design-for-Power (DFP) Methodology
• Low Power Design Analysis
• Power and Noise Integrity for Analog/Mixed-Signal Designs
• PathFinder™: Solution for Full-chip IC ESD Integrity
• Power and Signal Line EM Design and Reliability Validation Challenges
• Technologies for Power, Signal, Thermal, and EMI Sign-off

To download these White Papers and other valuable resources from our website, click here. Valid account required for some material.

For Apache's online Customer Support center, click here to register.

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